Patented tubing promises active cooling solutions
A CPS Corp product story
Edited by the Electronicstalk editorial team Aug 15, 2005
CPS has recently been awarded a patent for tubing integrally enveloped within AlSiC thermal management composite materials for active cooling solutions.
CPS has recently been awarded a patent for tubing integrally enveloped within AlSiC thermal management composite materials for active cooling solutions.
AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies.
Unlike traditional packaging materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio.
AlSiC's CTE matching capabilities eliminate the need for thermal interface stacking, increasing reliability in the field.
AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation.
Coupled with its superior CTE matching, AlSiC's high thermal conductivity reduces thermal induced stresses that can lead to electronic assembly failures.
The CPS AlSiC net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions.
Stainless steel cooling tubes, or heat exchanger cavities, can be captured during the fabrication process for an integrated solution.
The integration improves thermal performance, reducing thermal resistance between cooling tube or heat exchanger cavities and the matrix material by providing a metallic structural bond.
Cooling tubes have been integrated in CPS AlSiC structures for pieces as small as microprocessor lids to products as large as IGBT cooler bases.
Stainless steel cooling tubes are preferred for high purity water systems.
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