Composite makes ideal housing for opto devices
A CPS Corp product story
Edited by the Electronicstalk editorial team May 3, 2005
AlSiC (aluminium silicon carbide) metal matrix composite is ideally suited for optoelectronic housings and lids.
AlSiC (aluminium silicon carbide) metal matrix composite is ideally suited for optoelectronic housings and lids.
AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies.
Unlike traditional housing materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio.
AlSiC's CTE matching capabilities ensure the alignment and precision critical in optoelectronic applications.
Meeting the increased thermal behaviour requirements of the optoelectronics engineer, AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation.
Coupled with its superior CTE matching, AlSiC's high thermal conductivity prevents the bowing and flexing of packaging and substrate material that can lead to failure.
Traditional housing materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.
The CPS AlSiC near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions.
The unrestricted geometry of AlSiC enables the cost-effective inclusion of design features such as septums, walls and radial features.
The unique casting process enables integration of very high thermal conductivity inserts (more than 1000W/mK) or cooling tubes for more advanced thermal management solutions.
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