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Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Backside wafer coating process
Edited by the Electronicstalk Editorial Team on 27 July 2004
Mass imaging platform runs backside
wafer coating
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A new high throughput backside wafer coating process is capable of exceeding the +/-12.5mm total thickness variation stipulated by most wafer processing specialists.
DEK has successfully developed a high throughput backside wafer coating process, hosted on a cost-effective mass imaging platform and capable of exceeding the +/-12.5mm total thickness variation (TTV) stipulated by most wafer processing specialists The new process is compatible with underfill or adhesive-type coatings, normally applied at a nominal 50mm thickness to the backside of semiconductor wafers ahead of singulation