Product category: Electronics Manufacturing Machinery and Materials
News Release from: Novatec
Edited by the Electronicstalk Editorial Team on 2 August 2004
Pair to refine novel filling process
Rohm and Haas Electronic Materials and Novatec have signed an exclusive licensing agreement to make and sell an innovative filling process and device
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The invention has applications in the area of printed circuit board manufacturing such as those used in the automobile industry. It is claimed to revolutionise all the market's current techniques by eliminating previous problems associated to filling hollows or interconductor areas with dielectric on a printed circuit board.
In addition, the filling time with this innovative device is four times faster than current methods.
The filling process and the unique features of the device will help to optimise filling applications and provide optimum circuit board features.
Rohm and Haas specialises in electronics processes and solutions.
Novatec is a research lab focusing on the electronics assembly sector.
The two parties are combining their expertise in this exclusive agreement for the fabrication of an innovative serigraphy device that will be marketed in late 2004 and a deposition process called Durashield V42 filler that is already available on the market.
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