VJ Electronix unveils Summit 1800 rework system

A VJ Electronix product story
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Edited by the Electronicstalk editorial team Jul 28, 2009

VJ Electronix, a provider of X-ray inspection technology and rework systems, has introduced the Summit 1800 advanced rework system.

The system provides advanced features designed specifically to address difficult rework challenges, including lead-free rework for large components.

An increased 65mm alignment field of view with digital and optical zoom and split image ensure the precise placement of large packages, sockets and connectors.

The addition of programmable, motor-controlled top heater positioning, in conjunction with the Summit's independent pick-up motion, provides process flexibility.

VJ Electronix's Windows-based Sierramate 7.0 software improves on the Summit's simple operation and process control.

The new advanced auto profile with rules-based process development allows process engineers to set specific constraints to be applied during automatic profile generation.

This is a significant benefit for lead-free processes, according to the company.

An automatic prism shuttle designed to accommodate large components facilitates accurate and repeatable component alignment.

The system simultaneously looks up at the component and down at the board, providing a composite alignment view.

The digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a simple click on the graphical user interface.

The Summit 1800 incorporates independent, programmable motions for both pick-up and top heater height.

The pick-up motion allows precise placement force control and zero force removal.

The component pick-up tube features 360-degree Theta control and automatic alignment height, ensuring that the proper focus and image magnification of components is placed.

The programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force or to be located at a pre-set gap above the board.

With standard board handling of 457.2mm x 558.8mm, a placement accuracy of 0.0127mm to 0.0254mm and a magnification capability from 2X to 40X, the Summit 1800 offers users numerous benefits, including advanced thermal data collection and analysis with a trend capability, password-protected user accounts and positive flow control for the peak temperature protection of delicate components.

In addition, the system can rework the following applications: MCM, BGA, QFP, CPU sockets, vertical connectors, straddle-mount connectors, passive components, MicroSMD, flip chip, MicroBGA and CSP.

Various options are available for the Summit 1800, which include manual scavenger, component print station, cooling boost, sliding board support, a 431.8mm LCD monitor and a 558.8mm x 762mm board size upgrade.

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