ACM introduces RO4730 Lopro laminates
A Rogers Corp product story
Edited by the Electronicstalk editorial team Jul 27, 2009
The Advanced Circuit Materials (ACM) division of Rogers Corporation has introduced RO4730 Lopro laminates for base station, RFID and other antenna designs.
RO4730 Lopro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.
The specially formulated RO4730 Lopro thermoset resin system incorporates a hollow microsphere filler to achieve a low weight, light density laminate, which is approximately 30 per cent lighter than woven-glass PTFE materials.
RO4730 Lopro laminates have a matched dielectric constant of 3.0, providing a lower cost solution for high-frequency circuit boards used in base station and other antennas.
RO4730 Lopro laminates feature low Z-axis co-efficient of thermal expansion (CTE of about 40PPM/C) for design flexibility.
With a temperature coefficient of dielectric constant of about 23PPM/C, the laminates provide consistent circuit performance over short-term temperature ranges.
They feature the same high glass transition temperature (Tg) as Rogers' other high-performance RO4000 laminates, greater than 280C, making them lead-free and automated-assembly compatible.
RO4730 Lopro RoHS-compliant laminates are compatible with standard PCB fabrication techniques and plated-through-hole (PTH) processing.
Designed for base station and other RFID antennas, the proprietary, halogen-free laminates support longer drill-tool lifetimes than other filled materials, reducing fabrication costs.
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