Automotive-qualified MCUs reduce system footprint
A Silicon Laboratories product story
Edited by the Electronicstalk editorial team Nov 9, 2009
Silicon Laboratories has announced a line of C8051F5xx automotive-qualified microcontrollers (MCUs) that enable a reduction in system cost and footprint in body-electronics applications.
The integrated C8051F5xx family eliminates the need for discrete analogue components and offers high throughput.
The pin- and software-compatible eight-bit devices are suitable for cost-sensitive, space-constrained, embedded body-control applications, such as fan control, seat adjustment, window lifters and fuel-tank sensors.
The F5xx automotive MCUs offer a high level of mixed-signal integration, creating a footprint as small as 4 x 4mm.
The devices include an integrated precision-voltage reference, a 5V regulator and a high-accuracy on-chip oscillator, which enables high-speed control-area-network (CAN 2.0) and local-interconnect-bus (LIN 2.1) connections without an external clock crystal.
An automatic analogue-adjustment feature enables the use of lower-cost sensors.
The parts operate from 1.8 to 5.25V, eliminating the need for an external voltage regulator.
The MCUs feature automotive-grade embedded flash with densities available up to 32kB.
Offering a CPU throughput of up to 50MIPS, the F5xx range enables real-time computations instead of look-up tables, which reduces code size.
Signal processing algorithms can be implemented in real time, reducing the need for external filtering components.
The high digital throughput also enables the F5xx devices to be used in place of 16-bit MCUs.
Software compatibility throughout the F5xx range allows developers to maximise software reuse, while a variety of memory and processor options accelerate prototyping and streamline product development.
The C8051Fxx automotive MCUs are AEC-Q100 qualified, operate at up to 125C and are 5V tolerant.
Silicon Labs and its supply chain conform to ISO/TS 16949:2009 standards.
The C8051Fxx products are available in space-saving QFN packages, as well as leaded QFP packages.
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