Low-profile enclosures integrate sinking
A new range of low-profile extruded aluminium enclosures has been introduced by Lawtronics.
A new range of low-profile extruded aluminium enclosures has been introduced by Lawtronics.
The LHSK models provide a rugged low-thermal-impedance housing for sensitive electronics.
Developed to offer ease of access for mounting printed circuit boards of various sizes, they provide effective thermal contacts for power devices.
The free-standing or 3U rack-mount enclosures are supplied in two interlocking channels with end panels.
This enables the electronics to be worked on in situ before the other half of the casing is slid into place.
"Compact housings are always awkward to work with", commented Lawtronics' Technical Manager, David Winnett, "but this design allows free access for manufacturing as well as test instruments".
Eurocard or smaller circuit boards can slide into internal card guides, enabling power devices to be attached to the heatsink section of the vertical wall using only an M3 screw and half nut.
Circuit boards can be mounted either vertically or horizontally within the enclosures, and a spacer bar can be inserted to support heavy components.
The enclosures are offered in a variety of finishes, including specially developed coatings to enhance RFI shielding.
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