Flip-chip underfill boosts thermal conductivity
A Lord Corporation product story
Edited by the Electronicstalk editorial team Jul 22, 2008
Specifically formulated material increases reliability of in-package and chip-on-board applications by increasing the thermal dissipation from the die into the substrate.
Lord Corporation has developed a thermally conductive flip-chip underfill it reckons offers an improved thermal path for heat reduction.
Even though the typical thermal management practice for a flip-chip package uses thermal interface materials to drive the heat to the heatsink, some of today's complicated flip-chip packaging constraints do not allow for dissipating the heat through the back side of the die.
In response to this scenario, Lord ME-542 is a specifically formulated material designed to achieve high reliability for in-package or chip-on-board applications by increasing the thermal dissipation from the die into the substrate.
With high copper content in the substrate, driving the dissipation of heat into this layer is a very effective alternative to relying on heat dissipation solely through the solder joints to the substrate metallisation.
Lord Research and Development has used the latest in finite element analysis to accelerate the development of new products such as ME-542.
Using FEA modelling of the package properties allows better understanding of how a product will perform before the final package is constructed.
Case in point was the development of ME-542.
Unlike competing thermally conductive materials, ME-542 is jettable with minimal wear to the jet nozzle and it offers a fast flow without voiding under large die.
According to Jim Greig, Lord Electronics Market Manager: "In order to ensure reliable performance, an underfill encapsulant is needed to eliminate the failures caused by stress generated during flip chip operating cycles".
"Since the underfills need to be easy to apply, they must offer rapid and fault-free flow into the decreasing gap sizes and through the densely populated interconnect arrays under today's flip chip ICs".
"Flip chip packages targeted for high performance applications are rapidly increasing in functionality, complexity, size and I/O density", adds Greig.
"By improving the thermal path, heat can be more readily removed, allowing the component to operate at a cooler temperature and improve reliability".
"Simply, the increased thermal conductivity will provide the improved thermal path for heat reduction".
Lord ME-542 has a thermal conductivity of 0.8W/mK, a 500% increase over standard underfill products.
The new underfill material is engineered to quickly flow into gaps less than 25um with minimal filler settling and no voiding, encapsulating the fully populated interconnect arrays with a reliable layer of protective polymer.
"Our thermally conductive underfill development anticipated future needs to ensure high performance, cost-effective processing, durability and reliability", says Greig.
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