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Transceiver offers miniature USB option

A Cypress Semiconductor product story
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Edited by the Electronicstalk editorial team Sep 27, 2007

USB 2.0 transceiver comes with a package footprint of just 2.2 x 1.8mm.

The latest high-speed USB 2.0 transceiver from Cypress Semiconductor is available in the industry's smallest package.

The new MoBL-USB TX3LP18 transceiver is offered in a 20-pin WLCSP (wafer level chip scale package) that measures only 2.2 x 1.8mm - almost three times smaller than a standard golf ball dimple.

In addition to having a footprint 20% smaller than any competing solutions, the device offers ultralow power consumption.

This combination saves board space and prolongs battery life for a wide range of portable applications such as mobile handsets, PDAs, PMPs and GPS units.

The MoBL-USB TX3LP18 transceiver is compliant with the UTMI (USB 2.0 Transceiver Macrocell Interface) + Low-Pin Interface (ULPI) standard.

It delivers ultralow power consumption with a 0.5uA nominal sleep mode.

In addition to its small sise, the device integrates multiple passive components in order to further reduce boardspace usage and enable smaller end systems.

It removes the need for a dedicated 3.3V power supply with a wide input supply voltage range from 3.0 to 5.8V, and features an integrated phase-locked loop (PLL) to supply USB clocking requirements without a dedicated crystal.

"TX3 completes our portfolio of solutions for High-Speed USB support in portable applications", says Alakesh Chetia, Managing Director of Cypress's West Bridge Business Unit.

"Between our TX2 and TX3 USB transceivers, FX2LP18 high-speed controllers, and full bridge solutions like West Bridge Antioch, we are offering handheld system designers several solutions covering all possible performance needs".

"For multimedia handsets, high-speed USB is now a must, and Cypress can support any architecture".

The new CY7C68003 MoBL-USB TX3LP18 transceiver is available in the aforementioned 2.2 x 1.8mm WLCSP, and in a 4 x 4mm 24-pin QFN package.

The device is currently sampling and is expected to ship in production volumes later this year.

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