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Thermal inserts reduce cost and space requirements

A CPS Corp product story
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Edited by the Electronicstalk editorial team Aug 10, 2004

AlSiC (aluminium silicon carbide) metal matrix composite is ideal for military and defence electronics.

AlSiC (aluminium silicon carbide) metal matrix composite is ideal for military and defence electronics.

CPS' AlSiC provides highly reliable and cost-effective thermal management solutions for microwave packaging in TX/RX modules and phased array radar assemblies.

AlSiC allows a tailored coefficient of thermal expansion (CTE), offering a lightweight packaging solution for hybrid circuit housings in TX/RX modules.

The isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio.

AlSiC's CTE matching capabilities enable the mounting of high-power die directly onto the housing, rather than the substrate, eliminating the need for thermal interface stacking.

AlSiC exhibits the high thermal conductivity and CTE matching qualities ideal for carrier plates and frames in phased-array radar assemblies.

Providing advanced thermal management necessary for radar applications, CPS' unique casting process allows the integration of very high thermal conductivity inserts (1000W/mK), such as diamond and graphite, or cooling tubes.

This eliminates the need for traditional liquid cooling systems, ensuring AlSiC thermal inserts reduce cost and space requirements, while improving performance.

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