Forum takes CompactPCI to Chinese audience
An Advantech product story
Edited by the Electronicstalk editorial team Aug 3, 2004
The 2004 PICMG/PRC annual meeting and CompactPCI forum was successfully conducted by Advantech and the PICMG/PRC association on 9th July in Beijing, China.
The 2004 PICMG/PRC annual meeting and CompactPCI forum was successfully conducted by Advantech and the PICMG/PRC association on 9th July in Beijing, China.
Advantech, Intel, StarGen, Performance Technologies, and several local vendors were invited to present their solutions and products to help promote CompactPCI technology in China.
CompactPCI is an open system, which combines the best characteristics of VMEbus (ruggednes, high density and a modular Eurocard packaging system) with the low-cost, processor-independent aspects of PCI.
It is widely adopted in the telecommunication, automation and military/aerospace industries.
According to a recent VDC report, shipments of CompactPCI products using SBC architectures will exceed US $400 million dollars in 2004 and the compound annual growth rates are expected to be 3.5% from 2002 to 2007.
To help introduce the latest CompactPCI developments into China, Advantech and the PICMG/PRC association cohosted the "2004 PICMG/PRC annual meeting and CompactPCI forum" to assist CompactPCI deployment in the industrial automation and telecommunication industries.
The forum brought together over 400 delegates to learn about the latest CompctPCI developments and new products launched by Advantech, Intel, StarGen and several local manufacturers.
Advantech is one of the original CompactPCI advocators and devotees, and provides a complete CompactPCI product line, from various sized enclosures, to the most up-to-date CPU cards, to versatile I/O modules.
To promote and help partners use this technology in China, a dedicated R and D team has been set up at Advantech's Beijing office.
At the forum, innovative applications and solutions were demonstrated that focused on the automation and measurement, and telecommunications markets.
In the morning session, there were several keynote speeches that discussed CompactPCI technology trends and applications.
Chin Liu of Intel presented the strategy and product roadmap of "CompactPCI in embedded module communication".
Miguel Rodriguez of StarGen, one of the international PICMG 2.17 committee members, announced details of StarGen's latest products and applications.
Dr Leng of Sessia introduced embedded products in measurement systems for oil wells, SBCs in high speed data acquisition, and embedded products in building control.
There were two breakout sessions in the afternoon: "CompactPCI in automation and measurement" and "CompactPCI in telecommunications".
At the end there were showcase booths to demonstrate the latest applications and products.
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