Electronics manufacturing services
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing services
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Showing 626-643 of 643 articles
CIL expands into Somerset
CIL Custom Interconnect has opened a new 400m2 factory in Crewkerne, Somerset, for product finishing and final assembly and test.
News from CIL Custom Interconnect, Apr 12, 2002
New player in subcontract market
A new electronic and mechanical assembly service has been launched in the UK.
News from Custom Design Technologies, Apr 8, 2002
Hybrid lids fabricated and plated on same site
High-accuracy burr and stress-free stepped lids, essential for sealing semiconductor and optoelectronic hybrid package tubs, are now available from a single source.
News from Tecan Components, Mar 29, 2002
Texcel improves manufacturer's delivery response
Texcel Technology has enabled HV manufacturer Start-Spellman to improve its delivery flexibility as part of a strategic outsourcing agreement for low-volume, high-variety PCBs and subassemblies.
News from Texcel Technology, Mar 22, 2002
Contract manufacturer expands capacity
Contract electronics manufacturer BI Electronics has invested GBP 1.5 million in production equipment which has recently been installed in its plant in Norwich.
News from BI Electronics, Mar 19, 2002
Manufacturer expands bare chip assembly
Custom Interconnect has extended its bare chip assembly capability for both chip on board (COB) and multichip module (MCM) fabrication.
News from CIL Custom Interconnect, Feb 18, 2002
Subcontract manufacturing from RF specialist
RF Solutions is now able to offer its experience, expertise and facilities on a subcontract basis.
News from RF Solutions, Feb 12, 2002
Photo-electroforming provides precise components
Micro-engineered electroformed metal parts are gaining rapid ground, where traditional machined components cannot compete.
News from Tecan Components, Jan 25, 2002
Bespoke solutions from surface finishing facility
Tecan Components has invested GBP 500,000 in a new high-specification surface finishing facility, offering a wide range of bespoke solutions to OEMs and niche operators.
News from Tecan Components, Sep 3, 2001
Improved PCB layout and RF technology services
AB Electronic Assemblies (ABEA) has invested over GBP 500,000 to add new services to its portfolio.
News from AB Electronic Assemblies, Aug 31, 2001
BGA/fine-pitch rework and prototyping services
Texcel Technology has launched new BGA/fine-pitch rework and prototyping services, aimed at enabling these advanced space-saving technologies to be applied to smaller projects.
News from Texcel Technology, Aug 23, 2001
Seminars promote advantages of pin-in-hole reflow
Tecan Stencils (TSL) is to host a series of autumn seminars highlighting the advantages of pin-in-hole reflow (PIHR).
News from Tecan Components, Aug 8, 2001
Subcontract electronic manufacturing services
VTM (UK) is expanding its scope of operation by offering a subcontract electronic manufacturing service to industry.
News from VTM (UK), Jul 23, 2001
Refurbishment for Fuji assembly kit
A comprehensive refurbishment capability for Fuji surface-mount assembly machines is now being offered on a Europe-wide basis by pre-owned equipment supplier alternativeSMT.
News from alternativeSMT, Jun 25, 2001
On-site support keeps machinery running
Panasonic Industrial has introduced a new level of on-site technical support that will help customers of its Factory Automation systems to optimise their PCB production processes.
News from Panasonic Industrial Europe, May 16, 2001
Pocket-sized product needs 39m manufacturing line
Pioneer Technology is currently operating what is believed to be one of the longest manufacturing lines ever assembled.
News from Pioneer Technology, Apr 18, 2001
Semicustom solid-state switches save space
MCE Newmarket has launched a new range of semicustom solid-state switches designed to fill the gap between off-the-shelf components and fully customised designs.
News from MCE Newmarket, Apr 13, 2001
STATS expands GaAs packaging capability
ST Assembly Test Services has expanded its gallium arsenide capability to support package assembly for integrated circuits on presawn wafers down to a market-leading 4mil thick.
News from ST Assembly Test Services, Feb 13, 2001
Showing 626-643 of 643 articles
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