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Electronics manufacturing services

(a sub category of Electronics manufacturing, packaging)

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Electronics manufacturing services

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Latest articles from 'Electronics manufacturing services'

News releases from this sub-category

Showing 126-150 of 643 articles

Shared wafers offer access to 65nm process

Chip designers can fabricate devices on IBM's 65nm silicon foundry process using the Mosis multiproject wafer service, available in the UK from EDA Solutions.

News from EDA Solutions, Apr 23, 2007

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Chiu takes charge

Prominent semiconductor technology scientist Dr Tzu Yin Chiu is the new President and Chief Operating Officer at Silterra Malaysia.

News from Silterra Malaysia, Apr 18, 2007

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Electronics executive wins award

Chris Woods of ACW Technology, has won a Deloitte and Touche Director of the Year award in association with business lifestyle magazine Decision.

News from ACW Technology, Apr 17, 2007

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Chan spearheads sales in the USA

Dr Charles Chan is the new President of Silterra USA.

News from Silterra Malaysia, Apr 16, 2007

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Automotive contract comes to Remploy

Remploy Electronics has won a contract to manufacture the hardware component of Minorplanet Systems' Vehicle Management Information (VMI) systems.

News from Remploy Electronics, Apr 13, 2007

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Power amplifier booster runs on RF-CMOS process

Tower Semiconductor has begun manufacturing the XNN power amplifier (PA) booster for Paragon Communications.

News from Tower Semiconductor, Apr 13, 2007

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New managing director for contract manufacturer

Richard Brighton becomes managing director of Wiltshire-based contract electronics manufacturing company

News from Exception Group, Apr 12, 2007

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Chinese plant is part of wider CEM picture

A new manufacturing plant in China will help ACW appeal to customers interested in realising the cost benefits associated with outsourced manufacturing.

News from ACW Technology, Apr 12, 2007

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45nm process ready to run in September

Taiwan Semiconductor Manufacturing Company is aiming to complete 45nm technology qualification and enter production as early as September 2007.

News from TSMC, Apr 12, 2007

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Proprietary getter provides hard vacuum

Getter deposition services enhance wafer-level packaging of MEMS and other devices that require hard vacuum for device performance.

News from Innovative Micro Technology (IMT), Apr 11, 2007

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Space accreditation is a first for Europe

Accreditation recognises C-Mac's ability to design and manufacture hybrid microelectronics to the very high levels of quality and reliability demanded by the space industry.

News from C-Mac Micro Technology, Apr 10, 2007

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Foundry to manufacture CMOS image sensor

A specialist foundry is to manufacture a CMOS image sensor for use in the development of an advanced multispectral polarimetric imager (MSPI) that will be used for the study of atmospheric aerosols.

News from Tower Semiconductor, Apr 9, 2007

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Agreement makes bumps available round the world

Agreement brings electroless Ni UBM processing technology to Asia, and solder-bump, gold-bump and pillar-bump mass production technologies to North America.

News from IC Interconnect, Apr 4, 2007

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Memory modules to be manufactured by foundry

A licensing agreement allows non-volatile memory (NVM) modules for radio frequency identification (RFID) and mixed-signal applications to be manufactured by an independent specialty foundry.

News from Virage Logic, Mar 28, 2007

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Centres of excellence unite at Nepcon

Nepcon sees AWS Electronics Group show off three leading-edge operations in the UK and a factory in Slovakia.

News from AWS Electronics, Mar 26, 2007

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30-year veteran co-ordinates sales and marketing

Remploy Electronics has appointed Tim McKenna-Gorham as Sales and Marketing Co-Ordinator.

News from Remploy Electronics, Mar 26, 2007

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Contract provides boards for novel surgical laser

Pioneering laser surgery company Diomed has chosen Prism Electronics as lead supplier of electronic circuit boards for its ground-breaking Delta surgical diode laser.

News from Prism Electronics, Mar 19, 2007

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Zoran adopts cost-effective 0.16um geometry

Tower Semiconductor has begun manufacturing additional Zoran Corp ICs at Tower's FAB2, using its cost-effective 0.16um geometry.

News from Tower Semiconductor, Mar 16, 2007

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Positive report for Gallium Nitride strategy

An independent analysis concludes that foundry has developed a coherent strategy to pursue developing markets for GaN.

News from Strategy Analytics, Mar 14, 2007

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Offshore manufacturing is high-volume extension

New service combines UK manufacturing service levels and security of supply, with the immediate and ongoing cost savings associated with offshore manufacturing.

News from MPE-Electronics, Mar 13, 2007

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Shared wafers to run on IBM SiGe BiCMOS

Mosis now offers prototype and low volume fabrication access to IBM's fourth generation foundry technology, 8WL, the 130nm silicon germanium BiCMOS process.

News from EDA Solutions, Mar 12, 2007

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Shared foundry service adds access to IBM 65nm

Multiproject wafer service cuts cost of latest 65nm wafer fabrication technologies from IBM, including the foundry's low power and RF technologies.

News from EDA Solutions, Mar 8, 2007

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Process points to smaller electronic compass

Micromechanical magnetometers can be used in applications such as sensitive electronic compasses integrated in mobile phones or other mobile devices.

News from Technical Research Centre of Finland, VTT, Mar 8, 2007

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SMT line to expand Barking capacity

Remploy Electronics is to invest GBP 500,000 in a further surface mount technology PCB assembly production line at its Barking factory.

News from Remploy Electronics, Mar 8, 2007

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New appointments at electronics company

Electronics firm makes a raft of significant management appointments from inside and outside of the company.

News from Axis Electronics, Mar 2, 2007

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Showing 126-150 of 643 articles

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