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Product category: Electronics Manufacturing Services
News Release from: Tecan | Subject: Stepped lids
Edited by the Electronicstalk Editorial Team on 29 March 2002
Hybrid lids fabricated and plated on
same site
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High-accuracy burr and stress-free stepped lids, essential for sealing semiconductor and optoelectronic hybrid package tubs, are now available from a single source.
High-accuracy burr and stress-free stepped lids, essential for sealing semiconductor and optoelectronic hybrid package tubs, are now available from a single source, cutting out the time and quality problems associated with contracting out specialist production elements, such as plating Specialist electronic microcomponent supplier, Tecan has developed design and manufacturing techniques which ensure manufacturers have access to the most sophisticated, technology from its complete-service facility in Weymouth, Dorset