Editor's note: Readers of the free Electronicstalk weekly email newsletter will have read this news the week it was announced. Click here to request to be added to the circulation.
Crayford EMS specialist Texcel Technology has launched new BGA/fine-pitch rework and prototyping services, aimed at enabling these advanced space-saving technologies to be applied to smaller projects.
For many companies, the costs and risks of adopting new manufacturing technology are hard to justify for smaller volumes, but by optimising its contract EMS facilities for small to medium sized batch operation, Texcel is able to provide a complete turnkey service from prototype design, through to batch production.
They are also able to offer a fully trained and equipped BGA/uBGA/fine-pitch rework service, which provides a responsive and cost-effective alternative to returning failed boards to an offshore volume manufacturing plant.
The new service is based around a versatile aperture-based IR system, enabling work to be undertaken on a wide range of device profiles and types, without the need for specific tooling or nozzles.
This approach is designed to reduce costs, and decrease turn-round time, especially for small batches.
As with all Texcel offerings, staff training and process control are rigorous, with the laser guided top and bottom IR radiation constantly monitored by thermocouples to ensure minimum stress to surrounding areas of the PCB.
The overall process has already been proven in a recent project removing and replacing uBGA devices within mobile phones for a major manufacturer.
For customers looking for assistance beyond the PCB, Texcel is also able to combine this BGA/fine-pitch PCB service with system level design and production for a complete turnkey package.
 

• See contact details for Texcel Technology and other news
• Email this news to a colleague