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Product category: Electronics Manufacturing Services
News Release from: ST Assembly Test Services | Subject: GaAs packaging services
Edited by the Electronicstalk Editorial Team on 13 February 2001
STATS expands GaAs packaging capability
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ST Assembly Test Services has expanded its gallium arsenide capability to support package assembly for integrated circuits on presawn wafers down to a market-leading 4mil thick.
ST Assembly Test Services has expanded its gallium arsenide capability to support package assembly for integrated circuits on presawn wafers down to a market-leading 4mil thick in an ongoing effort to maintain a leadership role in supporting the mixed signal communications market segment "The growing demand for high-speed, high-performance devices is the driving force for GaAs technology", says Lee Hoong Leong, Vice President of Leaded Operations