Product category: Communications ICs (Wired)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TLK6B008
Edited by the Electronicstalk Editorial Team on 5 February 2004
Link doubles speed of legacy backplanes
A new advanced CMOS serial link enables 6Gbit/s transmission over legacy system backplanes that currently run up to 3Gbit/s
Further extending TI's expertise in high-speed serial and parallel I/O, this technology gives customers the ability to increase the port density of existing systems without having to replace legacy backplanes. 'The TLK6B008 capitalises on TI's high-performance, cost-efficient CMOS process to meet communications equipment manufacturers' need to pack more ports in less space, while providing excellent signal integrity across marginal backplane environments', said Martin Izzard, Director of the Fiber Optics and Backplane Business Unit of TI's high-performance analog business.
This article was originally published on Electronicstalk on 5 February 2004 at 8.00am (UK)
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'This new technology enables our customers to offer more cost-effective, high performance equipment to network service providers and enterprise customers'.
The TLK6B008 has eight 6.25Gbit/s bidirectional serial data channels on the sharp end and 16 x 3.125Gbit/s serial data channels on the blunt end, providing 100Gbit/s data throughput.
The receiver uses four-tap adaptive DFE (decision feedback equalisation) receive equaliser technology, including cancellation of the first post cursor.
The transmitter uses a four-tap equaliser with fully programmable coefficients at 5bit resolution.
This sophisticated equalisation compensates for ISI and crosstalk, which is essential for operating in legacy system environments.
The TLK6B008 extends the life span of today's XAUI (10G Ethernet) backplanes, thus preserving technology investments made by the system manufacturers.
When coupled with TI's advanced design methodology, a 6.25Gbit/s macro also enables high-density integration of many 6.25Gbit/s serial links on digital VLSI ASICs, including switch fabrics, to reduce overall system power, size and cost.
The technology is available today in TI's ASIC library, providing an integration path for customers seeking higher performance in their network infrastructure products.
The TLK6B008 comes in a 19 x 19-pin full-array FC-BGA package with 1mm ball pitch.
The TLK6B008 is available for sampling now to partner customers.
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