Aries expands BGA Switch-A-Pitch Adapter range
Aries has added new models to the BGA Switch-A-Pitch Adapter range, which simplifies high-density interconnect (HDI) construction to enable the use of smaller pitch devices on larger pitch boards.
The series now includes models with tops where the BGA landing pads are on a 0.4mm pitch and adapter bottoms are populated with BGA balls on a 1.27mm pitch.
The new adapters significantly reduce costs.
Designers can use readily available, and therefore less expensive, larger pitch boards because the adapters allow new, tighter pitch devices to be placed on existing larger pitch designs.
In addition, manufacturers can add components to designs at much lower costs, since the adapter tops leave open space around the location for the replacement device.
The Switch-A-Pitch design eliminates the need for laser-drilled microvias on motherboards.
Standard line and trace spacing down to 0.003in (0.75mm) can be used.
The adapters are 0.062in (1.57mm) thick FR4 or Rogers 370 HR with 1/2oz (14.17g) copper traces on both sides.
The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG) and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy.
The devices can operate up to 221F (105C) for FR4 or up to 266F (130C) for lead-free.
Suggested PCB pad size is 0.022in (0.55mm) for a 1.27mm pitch.
Switch-A-Pitch Adapters are part of Aries' Correct-a-Chip adapter series, which saves end-users time and money by reducing board design time.
Correct-A-Chip adapters can incorporate passive and active components and can enable the use of one termination style or pitch on a board designed for a different style or pitch.
The adapters are available in various forms, including panelised, adapter only or as a turnkey solution with mounted devices.
Special materials, platings, sizes and configurations are available from Aries upon request.
Switch-A-Pitch adapters are custom-made to customer requirements.
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