
Test Accessories
Latest articles from this sub-category
News releases from this sub-category
Showing 26-50 of 377 articles
Thermal management makes burn-in more accurate
Intelligent socket integrates heater, heatsink and thermal sensor, which calculates the precise amount of heat, or cooling, needed to maintain a device at a programmed temperature.
News from Antares Advanced Test Technologies, Feb 21, 2008
Switching matrix creates complex RF test systems
Economical modular switch and control platform can be used in applications from simple RF switching all the way to complex EMC systems.
News from Rohde and Schwarz, Feb 20, 2008
Harness and connector probe offers tip options
Screw-in probe is designed for push-back testing of wire harnesses and connectors.
News from Peak Test Services, Feb 15, 2008
Probes put handset protocols on test
System based on Agilent's 16900 logic analyser platform facilitates MIPI D-PHY hardware and software debug and reduces interoperability testing.
News from Agilent Technologies Europe, Feb 15, 2008
Test socket promises minimal signal loss
Socket is ideal for manual high-speed testing of devices such as CSP, micro-BGA, DSP, LGA, SRAM, DRAM and Flash, with pitches as low as 0.40mm.
News from Aries Electronics, Feb 11, 2008
Board sets the standard for DDR3 testing
Clock reference board enables memory module and system designers to validate DDR3 RDIMMs and simulate system-level functionality effectively and efficiently.
News from Inphi Corp, Jan 31, 2008
Probe meets demands of faster DRAM
Agilent's new DDR BGA probe provides direct access to the balls of the DRAM with low loading and minimal impact to signal integrity.
News from Agilent Technologies Europe, Jan 29, 2008
Liberty brings signal integrity expertise
Combined company will help customers achieve electrical performance objectives in test and functional interconnect with signal integrity validation and simulation.
News from Ardent Concepts, Jan 23, 2008
Switches enable high-speed ATE systems
Coaxial solid-state PIN diode switches target engineers designing manufacturing test systems or requiring a fast switching solution to validate component performance.
News from Agilent Technologies Europe, Jan 21, 2008
Screw-in probes test harnesses and connectors
Nonrotating blade-shaped tip styles ensure perfect alignment when used in connector blocks.
News from Peak Test Services, Jan 11, 2008
Wafer probing provides 45nm resolution
Users of the Elite 300 wafer probe station won't have to retool at each process node or lose business to competing foundries with more accurate test capabilities.
News from Cascade Microtech, Jan 8, 2008
DC-coupled amp allows sensitive measurement
Laser Components has expanded its amplifiers portfolio with the HCA-400M-5K-C high-speed current amplifier from Femto.
News from Laser Components (UK), Jan 4, 2008
Fine-pitch burn-in socket takes larger devices
Sockets use compression mount technology, in which the flexible contacts are pressed onto the contact pads of the PCB by screwing the socket to the board.
News from Yamaichi Electronics, Dec 27, 2007
Wideband power sensor works with PCs
The NRP-Z81 is suitable for the analysis of radar and communications signals up to 30MHz RF bandwidth with a sensor rise-time of less than 13ns.
News from TTi (Thurlby Thandar Instruments), Dec 7, 2007
Compact RF switch eases device testing
Device measures only 2.5 x 2.5 x 1.4mm and is designed to reliably test microwave frequencies throughout a product's development stage up to final production.
News from Murata Electronics (UK), Nov 30, 2007
Current transformer upgrades power analysis
Unit offers a high-precision alternative to current clamps in applications where current measurements need to be made on already installed conductors.
News from Yokogawa Europe - Test and Measurement, Nov 27, 2007
Chambers apply more thermal stress
Temperature and humidity chambers offer faster temperature changes to apply thermal stress to units under test.
News from Unitemp, Nov 22, 2007
Solid-state amps aid comms and EMC tests
High linearity amplifiers are particularly suitable for use in systems such as CDMA, GSM, AMPS and TACS.
News from Link Microtek, Nov 19, 2007
Reference gateway sets standard for VoIP
The MFE VIII is ideal for system optimisation and development as well as quality control and benchmark testing.
News from Head Acoustics, Nov 12, 2007
Threaded probes get into tight spaces
The P70/G Series threaded test probe is believed to be the shortest threaded probe available for 2.54mm (0.1in) centres.
News from Peak Test Services, Nov 6, 2007
Semiconductor socket accommodates 0.35mm pitches
Antares Advanced Test Technologies' 880 series clamshell burn-in socket can accommodate the latest QFN packages and reduce maintenance-related downtime.
News from Antares Advanced Test Technologies, Oct 31, 2007
Extension cable takes probes to extremes
Probing solution enables oscilloscope measurements in environmental chambers and in other settings with extreme temperature conditions.
News from Agilent Technologies Europe, Oct 30, 2007
Switch probe is designed for rear assembly
Rear assembly allows efficient, simple and quick replacement, with the probe being screwed into the receptacle without having to dismantle the fixture or module.
News from Peak Test Services, Oct 22, 2007
Test socket aids mass production
The Quatrix Kelvin QFN test socket allows chipmakers to migrate Kelvin-configuration testing of QFN packages from the lab to mass production
News from Antares Advanced Test Technologies, Oct 3, 2007
Enclosures protect against shocks
The risk of an electric shock during product testing is completely eliminated with the latest range of test fixtures and enclosures from electrical safety testing specialist Clare Instruments.
News from Clare Instruments, Oct 2, 2007
Not what you're looking for? Search the site.
Featured articles

- Captronic Systems introduces Capture FRA
Capture FRA is a PC-based frequency response analysis product that uses the single sine technique to provide precise measurements of gain and phase between any two points in a system.

Categories
- Active Components (11,969)
- Passive Components (2,972)
- Design and Development (9,414)
- Enclosures and Panel Products (3,247)
- Interconnection (2,855)
- Electronics Manufacturing, Production, Packaging (3,073)
- Industry News (1,904)
- Optoelectronics (1,626)
- Power Supplies (2,309)
- Subassemblies (4,579)
- Test and Measurement (4,979)