Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Ultrathin coating
Edited by the Electronicstalk Editorial Team on 03 August 2006

Package permits ultrathin coatings

A next-generation equipment and tooling package enables the coating of wafers with ultrathin die attach materials down to 25 microns in thickness.

Fuelled by the need for faster processing times and smaller device footprints, DEK has developed a next-generation equipment and tooling package that enables the coating of wafers with ultrathin die attach materials down to 25 microns in thickness Traditional dispensing methods and paste die attach processes have manufacturing challenges such as the inability to achieve emerging UPH (units per hour) requirements, limitations on chip footprint due to chip fillet formation and resin bleed and inherent quality and reliability issues that result from insufficient or uneven adhesive coverage