Product category: Electronics Manufacturing Services
News Release from: IC Interconnect
Edited by the Electronicstalk Editorial Team on 4 April 2007
Agreement makes bumps
available round the world
Agreement brings electroless Ni UBM processing technology to Asia, and solder-bump, gold-bump and pillar-bump mass production technologies to North America
IC Interconnect (ICI), a wafer-bumping service company, has announced an agreement with Jiangyin Changdian Advanced Packaging (JCAP), a company specialising in solder-bump, gold-bump and pillar-bump mass production. The agreement brings ICI's electroless Ni UBM processing technology to Asia, and JCAP's multitude of bumping technologies to North America.
Related stories
Pad resurfacing process uses less gold
IC Interconnect's Ni/Au pad resurfacing process for high-temperature wire bond applications produces bonds that are stable at high temperatures with a thinner gold layer
Wafer bumping services extended
IC Interconnect (ICI), a wafer bumping service company, announces its wafer test, laser marking, die singulation, and tape and reel capabilities available as standard service offerings
IC Interconnect is the sole business representative for JCAP worldwide services in North America.
'This new relationship is truly beneficial to both IC Interconnect and JCAP', says Curt Erickson, President of IC Interconnect.
'We are excited to come together to offer our customers around the world more choices and flexibility for their wafer-bumping needs'.
Further reading
Wafer bumping approved to automotive standards
Wafer bumping service company IC Interconnect has successfully completed its registration audit for ISO/TS16949:2002 and 9001:2000
The agreement establishes ICI/jcap International, a wholly owned subsidiary of IC Interconnect.
ICI/jcap International is the marketing, sales, engineering and customer support arm of JCAP in North America.
It also makes available a facility where IC Interconnect can install and operate its electroless Ni UBM process in China.
ICI/jcap International offers services in North America at IC Interconnect for the life of the product or the option to migrate it from the US to China as economics dictate, while providing seamless engineering and on-going customer support.
Customers can now: pick a bumping technology; pick a process location; and pick engineering and customer support time zones.
JCAP, based in Jangyin, China, is the only factory in the world with a patent to produce copper-pillar bumps.
Additional technologies include thin-film UBM, electroplated solder, gold-bump and ball-drop WLCSP.
All are augmented with grind and back-metal capabilities.
Post-bump processes include wafer test, laser mark, saw, tape and reel and mixed technology module assembly.
• IC Interconnect: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Related Business News
Fdi In Malaysia Slips
Washington, April 3 (Bernama) -- Malaysia's goal of attracting and retaining higher value manufacturers faces a challenge as it fails to keep pace with improvements in the business climate needed to attract these manufacturers, a US government report rel
Taiwan Shares Climb 0.9 Percent
Taiwan shares rose on Thursday as investors were cheered by U.S. stock gains overnight. The Weighted Price Index of the Taiwan Stock Exchange rose 49.39 points, or 0.9 percent, to close at 8061.28.
Acxiom Agrees to Be Acquired by...
...Silver Lake and ValueAct Capital for $3.0 Billion. Acxiom Corporation announced today that it has entered into a definitive agreement to be acquired by Silver Lake, the leading investment firm focused on large-scale investments in technology-driven growth industries, and ValueAct
Opnext Reports Fourth Quarter and Full Year Operating Results
Opnext, Inc. , a global leader in the design and manufacturing of optical modules and components, today announced preliminary and unaudited financial results for the fourth quarter and full year ended March 31, 2007.
Vista Partners Updates Coverage on TXP...
...Corporation; Maintains $0.80 Price Target. Vista Partners announced today that it has update coverage on TXP Corporation . Vista Partners provides equity research to institutional and individual investors, with a focus on publicly traded small capitalization companies.
Search the Pro-Talk network of sites
