Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Renesas Technology Europe | Subject: SH-MobileL3V2 and SH-MobileUL
Edited by the Electronicstalk Editorial Team on 16 October 2007
Microprocessors offer video support
The SH-MobileL3V2 and SH-MobileUL microprocessors incorporate a high-performance, low-power multi-Codec video processing IP.
Renesas Technology Europe has added two microprocessors to the SH-Mobile series for application processing targeting digital TV capable mobile phones The SH-MobileL3V2 and SH-MobileUL incorporate a high-performance, low-power multi-Codec video processing IP from Renesas
This article was originally published on Electronicstalk on 15 Apr 2004 at 8.00am (UK)
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The SH-MobileL3V2 features on-chip image quality improvement functions such as gamma correction and an enlargement edge enhancement function.
The gamma correction functions available are histogram extension, screen brightness correspondence and adaptive type chroma.
This allows adjustment of image quality for individual TV scenes, enabling clear, high-quality video display to be achieved.
The enlargement edge enhancement function prevents fuzziness when a QVGA-size image is enlarged to VGA or WVGA size.
Such picture quality improvement is achieved by performing enhancement and inter-dot compensation in edge areas and noise elimination by means of a filter.
Further features are a dedicated on-chip 24bit audio DSP for low-power audio processing and a 5Mpix capable camera interface.
Additional on-chip peripheral functions suited to mobile phone systems include an LCD controller supporting 24bit TFT colour liquid crystal panels, an SD memory card interface, a SIM card interface and a sound interface.
The SH-MobileUL features an optimised set of peripheral functions specialised for terrestrial digital broadcast applications.
While incorporating the same moving image engine and high-performance CPU core as the SH-MobileL3V2, the SH-MobileUL is a cost-performance oriented product.
It has more compact dimensions due to a smaller pin count and the use of a small 8 x 8mm package.
This enables the mounting area to be reduced by approximately 30% compared with the previous SH-Mobile products.
The SH-MobileL3V2 uses a 281-pin BGA package (9 x 11mm, 0.5mm pin pitch) and the SH-MobileUL a small 224-pin BGA package (8 x 8mm, 0.5mm pin pitch).
The SH-MobileL3V2 has 256Mbit SDRAM and the SH-MobileUL 128-Mbit SDRAM, as a SiP (System in Package), enabling compact mounting.
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