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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Renesas Technology Europe | Subject: Five-layer stacked SiP
Edited by the Electronicstalk Editorial Team on 15 April 2004
Five-layer package takes in MCU, logic
and memory
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A novel five-layer stacked SiP (system in package) device combines a high-performance SuperH microprocessor, logic LSI chip and memory chips in a single package.
A novel five-layer stacked SiP (system in package) device combines a high-performance SuperH microprocessor, logic LSI chip and memory chips in a single package This new product increases the current maximum number of stacked chips in an SiP from three to five, offering users a wider choice of chip combinations while enabling the mounting area to be reduced by approximately 70 to 80% (Renesas Technology comparison)