I/O module at the point of interface testing

The Cion Module/FXT114S is highly suitable for the test of nonscannable circuit clusters, peripheral connectors, backplanes and AC-coupled networks.

New from Goepel Electronic at APEX, the Cion Module/FXT114S is an all-new I/O module that provides a total of 114 parallel I/O channels with IEEE1149.1 compliant test resources.

50 of the 114 channels also support IEEE1149.6 for structural testing of high-speed differential interfaces.

And, thanks to the small dimensions of the Cion/FXT114S, the module can easily be integrated into test adapters.

"With this new I/O module we are addressing the growing demand for structural test support of advanced digital networks featuring IEEE1149.6 capabilities", says Raj Puri, Vice President Marketing and Sales at Goepel Electronics.

"The combination of IEEE1149.1 and IEEE1149.6 I/O capabilities on a single module for integration into test adapters offers our customers a low-cost alternative to extend their structural test capabilities for high-speed interfaces in production environments".

The Cion Module/FXT114S provides 64 single-ended test channels, controlled by Goepel Electronic's Cion ASIC devices.

All channels are independently controllable as input, output or tristate, and the I/O voltage can be programmed from 1.8 to 5.0V in groups of 32 channels.

Additional pin driver features support a high current capability, while special safety measures, such as the Cion's "Unstress" feature, protect the unit under test (UUT) against damage in case of short circuits.

In addition to the single-ended I/O channels, the Cion Module/FXT114S provides 50 differential (LVDS) channels with IEEE1149.1 and IEEE1149.6 compliant test resources.

Of those differential channels, 25 are configured as inputs and the other 25 are configured as outputs.

If additional test channels are required in addition to those available on the Cion Module/FXT114S, multiple Cion modules of the same or different types are easily daisychained through their TAP interfaces.

These capabilities make the Cion Module/FXT114S highly suitable for the test of nonscannable circuit clusters, peripheral connectors, backplanes and AC-coupled networks in applications for example in the telecommunication, industrial and embedded control, aerospace and automotive industries.

This new Cion module is fully supported by the System Cascon integrated JTAG/boundary scan software platform and can be used with any ScanBooster and Scanflex boundary scan controller.

Users can easily include the Cion Module/FXT114S in a test project, generate the desired test vectors fully automated with ATPG tools supporting both IEEE1149.1 and IEEE1149.6, and obtain detailed diagnostic results in case of faults detected during test execution.

Detected faults are visualised at pin and net level (eg in the UUT's layout file) and the UUT is debugged interactively.

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