
Week 9 March - 15 March 2003
Showing 1 - 10 of 101 articles
Efficient power amplifiers boost battery life
A new series of power amplifier modules promises the industry's best power-added efficiency for CDMA and GSM phones, allowing manufacturers to increase mobile phone battery life by as much as 15%.
News from Agilent Technologies, 14 March 2003
Wireless technology aims for medical device market
User Application Article
An exciting new set of capabilities has come to medical device design with the adoption of wireless technology enabled by products such as the Astric family of SoC transceivers from AMIS.
News from AMI Semiconductor, 14 March 2003
Convertor switches modes to suit conditions
A novel 500mA DC/DC synchronous step-down convertor operates over a wide range of input and output conditions and provides an efficient method of transforming battery or bus voltages.
News from Microchip Technology, 14 March 2003
Package design suite simplifies die stacking
Cadence Design Systems has developed a new capability for designing stacked-die packages.
News from Cadence Design Systems, 14 March 2003
Software handles up to 64 channels of acquisition
The Dewesoft data acquisition package supports a range of hardware in both PCI and CompactPCI formats with up to 64 channels and offers both recording and analysis functions.
News from Dewetron UK, 14 March 2003
CE.NET on the LaunchPad
DSP Design has a new LaunchPad PC/104 application development kit for Windows CE.NET.
News from DSP Design, 14 March 2003
French exposure for novel switch technologies
Tastitalia is offering a cost-saving incentive for OEMs to convert to Duraswitch's electronic switch technologies by eliminating the tooling costs for new and old designs.
News from Duraswitch, 14 March 2003
Network search engines accelerate gigabit routers
User Application Article
Furukawa Electric has selected IDT's 256Kx36 and 128Kx36 NSEs to accelerate packet processing and enable intelligent application management in its next-generation Fitelnet G-Series gigabit routers.
News from IDT, 14 March 2003
Technology lays wireless foundations
Intel Centrino mobile technology will integrate wireless capability into a new generation of mobile PCs that will bring users greater freedom to connect in new places and in new ways.
News from Intel Corporation, 14 March 2003
Third OLED seminar set for Montreal
The third seminar of the series "The fundamentals of OLED fabrication" will take place at the Le Centre Sheraton Montreal Hotel on 1st to 2nd May 2003.
News from Intertech Corp, 14 March 2003
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Featured articles

- Tyco Ethernet link has double port density
Tyco has launched the RJ point five connector system Ethernet link, designed to offer double the port density of the standard RJ 45 Ethernet link while maintaining field termination capability. - AC/DC power supplies are medically approved
TDK-Lambda has introduced the NVM175 range of medically approved AC/DC power supplies.

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