
Week 15 September - 21 September 2002
Showing 1 - 10 of 106 articles
Swiss convertor range comes to the UK
Amplicon Liveline has recently been appointed by Fabrimex to distribute its range of power convertors in the UK.
News from Amplicon Liveline, 20 September 2002
Thermal tape sticks sinks to plastic BGAs
Thermattach T410 thermal tape from Chomerics has been developed to provide a reliable method for bonding heatsinks to hot-running devices.
News from Chomerics Europe, 20 September 2002
Farnell goes onsite for Lockheed Martin
Premier Farnell has been selected to provide Lockheed Martin with an onsite dedicated procurement specialist.
News from Farnell InOne, 20 September 2002
USB hardware debug probe aids 32 and 64bit design
A new low-cost plug-and-play USB hardware debug probe helps simplify the debugging of sophisticated embedded programs by providing program download and run control without the need for a ROM monitor.
News from Green Hills Software, 20 September 2002
Speedy operation from low-on-resistance switches
Four new high-performance analogue switches from Intersil offer the industry's lowest on resistance and fastest switching times for switches the +15V maximum range.
News from Intersil, 20 September 2002
Improved performance from cleaning tanks
Kerry Ultrasonics has launched two new pieces of ultrasonic cleaning equipment.
News from Kerry Ultrasonics, 20 September 2002
Low noise and small size for step-down regulators
The MAX1973 and MAX1974 are reckoned to be the smallest 1A step-down regulators for network, telecomms, cellular basestation, fibre modules, wireless modems and xDSL equipment.
News from Maxim Integrated Products, 20 September 2002
Design planner shrinks telecomms chip
User Application Article
The IC Wizard hierarchical design planner has enabled the Telecommunication Network Systems Group of Fujitsu to achieve a 15% reduction in die size on a 3.3 million gate telecomms chip.
News from Monterey Design Systems, 20 September 2002
System speeds automotive controller design
The MathWorks and Accurate Technologies (ATI) have developed a powerful, cost-effective rapid prototyping and calibration system for automotive powertrain design.
News from The MathWorks, 20 September 2002
Module puts Virtex-II Pro FPGAs to embedded use
BenPro is the world's first Virtex-II Pro Dime-II module offering maximum scalability and maximum communications bandwidth for telecomms, data networks, DSP and embedded processing applications.
News from Nallatech, 20 September 2002
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Featured articles

- Linear unveils triple-output DC/DC uModule
Linear Technology has introduced the LTM4615, a complete triple-output DC/DC uModule regulator system. - Power interconnects make better use of airflow
Tyco Electronics has developed a range of power interconnects, comprising the Multi-Beam XLE and Minipak HDL connectors, to meet the demand for increased current density with modular power solutions.

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