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Product category: Electronics Manufacturing Machinery and Materials
News Release from: Vistec Electron Beam | Subject: SB250
Edited by the Electronicstalk Editorial Team on 10 April 2006

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A universal cost-effective e-beam system for both direct write and mask making applications enables users to react flexibly to market demands

New from Vistec Electron Beam at Semicon Europe 2006, the SB250 is a universal cost-effective system for both direct write and mask making applications to enable the customer to react flexibly on market demands. The modular system architecture gives the variable shaped beam (VSB) system flexibility for a range of applications and to meet specific customer requirements.

In addition, the modular architecture allows the SB250 to be easily upgraded to a higher tool performance.

The SB250 is equipped with a 210 x 210mm2 stage travel range, which enables exposing masks up to 7in and wafers up to 200mm diameter.

The field-proven 50keV shaped-beam column, 'write-on-the-fly' writing mode as well as the fully automatic substrate handling are further highlights of the new SB250 series.

'With the SB250 we offer a reliable and proven technology for GaAs and Si direct writing, integrated optics, mask production, and applied research', explains Project Manager Thomas Haendel.

'We developed this new product line to meet the demand for a cost effective, universal system for direct and mask writing applications', adds Vistec Electron Beam General Manager Dr Sebastian Toelg.

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