http://www.electronicstalk.com/indexes/categorybrowsemi.html IC and hybrid processing equipment latest news on Electronicstalk en-gb Copyright (C)2010 Pro-Talk Ltd. All rights reserved. Mon, 27 Dec 2010 08:00:00 UT Mon, 27 Dec 2010 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 SPP Process Technology Systems (SPTS) has received an order for a Pegasus DSi Deep Silicon etch system, supported on the Omega FXP cluster platform, for a 3D-IC through silicon via (TSV) application. Wed, 02 Jun 2010 08:00:00 UT SPP Process Technology Systems http://www.electronicstalk.com/news/srf/srf121.html Stratedge's SM range of packages fits aerospace, avionics, automotive and telecom-industry applications, and is especially suited for LEDs, MEMS and optical devices. Mon, 31 May 2010 08:00:00 UT Stratedge http://www.electronicstalk.com/news/stx/stx113.html Oxford Instruments Plasma Technology (OIPT), has launched the Nanofab800Agile System. Mon, 07 Sep 2009 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr114.html DEK has developed the Galaxy thin silicon wafer processing system. Tue, 04 Aug 2009 08:00:00 UT DEK http://www.electronicstalk.com/news/dek/dek286.html Oxford Instruments has launched Crystalflex, a multi-wafer hydride vapour-phase epitaxy (HVPE) reactor. Mon, 18 May 2009 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr113.html Atmel Corporation has announced its AT88SA range of low-cost, ultra-low power, super-secure cryptographic authentication ICs. Thu, 30 Apr 2009 08:00:00 UT Atmel Corporation http://www.electronicstalk.com/news/atl/atl207.html The technical team at Oxford Instruments-TDI, led by Dr Alexander Usikov, is working closely with a light-emitting diode (LED) manufacturer to make semi-polar GaN layers for optoelectronic devices. Thu, 12 Mar 2009 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr112.html Researchers have developed a thin-film coating providing an unparalleled level of surface passivation of crystalline silicon solar cells, using Oxford Instruments' FlexAL ALD tool. Wed, 18 Feb 2009 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr111.html TDI, an Oxford Instruments company, has recently advanced the Hydride Vapour Phase Epitaxy (HVPE) technology to the growth of InGaN. Fri, 24 Oct 2008 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr110.html SAFC Hitech has introduced a line of high-purity halides, which will enable the growth of scintillation detector crystals. Tue, 21 Oct 2008 08:00:00 UT SAFC Hitech http://www.electronicstalk.com/news/sav/sav101.html Challenger Components is promoting the Ecomate circular connector series from Amphenol-Tuchel Electronics. Fri, 10 Oct 2008 08:00:00 UT Challenger Components http://www.electronicstalk.com/news/chg/chg101.html Breakthrough chamber design and improved wafer handling makes XeF2 a viable process for high volume production. Mon, 04 Aug 2008 08:00:00 UT Surface Technology Systems http://www.electronicstalk.com/news/srf/srf120.html The Starlase range now addresses a multitude of applications on commonly used substrates including those used in the manufacture of solar cells. Thu, 31 Jul 2008 08:00:00 UT Powerlase http://www.electronicstalk.com/news/poj/poj114.html Ion beam technology tool offerings are suitable for both R and D and batch production capabilities. Mon, 28 Jul 2008 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr109.html The Bondjet BJ820 platform handles 12.5 to 85um diameter wire bonding and ribbon bonding from 6 x 35 to 25 x 250um. Mon, 28 Jul 2008 08:00:00 UT Hesse & Knipps http://www.electronicstalk.com/news/hes/hes101.html