Resists allow copper coverage in hot-air levelling
An UL International product story
Edited by the Electronicstalk editorial team May 6, 2010
Due to their good adhesion and no-bleeding properties, UL's SD 2462 NB-M series solder resists are suitable for covering copper PCBs during the hot-air-levelling process.
UL has extended approval for the thermal-curing two-pack solder resist SD 2402 NB-M - colourless transparent, mat; and the SD 2442 NB-M - black, mat.
Both solder resists achieved the best flame class UL 94 V-0.
The solder-bath resistance of 20 s at 288C tested in addition shows that these lacquer systems meet the current requirements concerning thermal resistance during lead-free soldering.
The SD 2462 NB and SD 2462 NB-M two-pack solder resists, based on epoxy resin, are applied by screen printing.
They are said to exhibit excellent contour definition, good edge coverage even in case of high conductor buildup and an outstanding chemical resistance.
SD 2442 NB-M can be used for coating the substrate within LED applications, in order to avoid light reflections of the base material and to increase the contrast to the LED.
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