Product category: Reference Designs
News Release from: TTPCom
Edited by the Electronicstalk Editorial Team on 1 March 2004
TTPCom and Intel go to the Edge
TTPCom has extended its collaboration with Intel Corp to encompass the development of Edge and 3G platforms for mobile devices
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Collaboration with Intel bears fruit
TTPCom is celebrating the first volume shipment of handsets to result from its collaboration with Intel
First fully accredited portable 3G protocol stack
TTPCom's software is first portable 3G protocol stack to achieve full GCF and IOT accreditation
This builds on the extensive work that the companies have undertaken over the last few years in GSM/GPRS. The combination of Intel's cellular processors and TTPCom's protocol and application software provides the performance and flexibility required for the rapid development of next generation handsets, smartphones and converged mobile devices.
The first customer to be announced for the 3G platform is Asustek Computer, a leading manufacturer of handheld devices and computing equipment, who are developing a range of 3G feature phones and smartphones for launch towards the end of 2004.
In 3G, TTPCom and Intel are developing a complete dual-mode 3G/GSM platform which enables mobile devices to handover seamlessly between existing GSM/GPRS networks and new 3G networks.
The first 3G chip to be made available is a new family of cellular processors, codenamed "Hermon" disclosed by Intel last week at the 3GSM World Congress.
To enable handset and mobile device manufacturers to take advantage of higher network speeds prior to the deployment of 3G, Intel launched a complete Edge solution based on the Intel PXA800EF cellular processor last year.
With three times the bandwidth of existing 2.5G (GPRS) networks Edge enables the early deployment of 3G type services and Edge-capable handsets will be able to offer advanced services such as video messaging, high quality multimedia and increased data capabilities.
Further reading
DigRF interface suits RF and baseband for 3G
TTPCom's 3G DigRF solution is designed to enable semiconductor device vendors to quickly and easily add a 3G DigRF compliant digital interface to both 3G RF and baseband ICs
Systems integrator adds expertise to ecosystem
TietoEnator, one of Europe's largest IT and software services providers, has joined the Ajar platform ecosystem
Engineers wanted for mobile platform development
TTPCom is recruiting a significant number of engineers to join the development team working on its Ajar platform - the definitive mobile applications framework for mass market handsets
Protocol software goes out with single-chip phone
TTPCom has extended its partnership with Silicon Laboratories to allow its GSM/GPRS protocol software to be distributed directly on Silicon Laboratories' AeroFone single-chip cellular platform
TTPCom is supporting this solution with a complete protocol and application software platform.
"The combination of Intel's hardware solutions with TTPCom's proven software provides mobile device manufacturers with state of the art platforms, and the extension of our work from GSM/GPRS to Edge and 3G delivers a very clear roadmap for the development of next generation terminals", stated Tony Milbourn, Managing Director at TTPCom.
"The advanced capabilities of Intel's cellular processors provide a powerful hardware environment for exciting new products such as smartphones and multimedia rich mobile devices, whilst in the applications space, TTPCom's flexible framework enables the rapid integration of new services that exploit the increasing bandwidth available from Edge and 3G networks".
"Our commitment to TTPCom's advanced software builds on our successful entry into the wireless communications market and provides a clear roadmap for future product developments", stated Gadi Singer, Intel Vice President and General Manager of its Cellular and Handheld Group.
"Each stage of our product offering builds on a common architecture, utilises common development tools and benefits from years of TTPCom's conformance and interoperability testing.
Manufacturers developing multiple products based on the combined Intel/TTPCom solutions will gain many synergies including lower investment costs, reduced risk from re-use of proven technology and ultimately a much faster time to market".
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