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Product category: Intellectual Property Cores
News Release from: TTPCom | Subject: 3G DigRF solution
Edited by the Electronicstalk Editorial Team on 21 July 2006

DigRF interface suits RF and baseband
for 3G

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TTPCom's 3G DigRF solution is designed to enable semiconductor device vendors to quickly and easily add a 3G DigRF compliant digital interface to both 3G RF and baseband ICs.

TTPCom's 3G DigRF solution is designed to enable semiconductor device vendors to quickly and easily add a 3G DigRF compliant digital interface to both 3G RF and baseband ICs This extends to dual system 3G chipsets the benefits of DigRF which include; greater integration, reduced component count, easier board level design and manufacturing and plug and play flexibility between RF and baseband ICs