Click on the advert above to visit the company web site

Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TMS320VC5501/2
Edited by the Electronicstalk Editorial Team on 11 December 2002

Budget-busting dual-MAC DSPs
run up to 300MHz

Two new low-power digital signal processors deliver 300MHz performance at the lowest price points in the industry

Two new low-power digital signal processors from Texas Instruments deliver 300MHz performance at the lowest price points in the industry. By leveraging the proven low-power TMS320C55x DSP architecture, the new devices enable embedded designers and manufacturers to offer next-generation functionality and longer battery life while realising significant cost savings in applications such as embedded telecomms, consumer audio, medical, biometrics and industrial sensors.

The dual-MAC TMS320VC5501 DSP and TMS320VC5502 DSP extend the world's most popular TMS320C5000T DSP platform to 32 code-compatible devices.

The C5502 DSP is scheduled to sample in the first quarter of 2003 for $9.95 (10,000 unit quantities) in 176-pin LQFP (24 x 24mm) and 176-pin MicroStar BGA (15 x 15mm) packages, whereas the C5501 DSP is scheduled to sample in the third quarter of 2003 for $5.00 (10,000 unit quantities).

TI also offers the C5502 DSP with 200MHz performance at $7.95.

'With the C5501 and C5502 DSPs, TI has once again raised the bar on the performance, power and price paradigm', said Will Strauss, President, Forward Concepts.

'By delivering higher performing, low-power DSPs at an aggressively low price, TI is paving the way for even greater DSP proliferation, since real-time signal processing is becoming the key ingredient in virtually every innovative, smart, embedded device'.

The C5501 is the first 300MHz dual-MAC DSP to be offered at $5.00 while boasting the industry's lowest power consumption at just under 200mW.

For industrial applications that require extended temperature, the C5501 and C5502 both support temperatures ranging from -40 to +85C.

Both new devices are also the first 300MHz DSPs to be offered in the easy-to-layout, low-profile quad-flatpack packaging (LQPF).

The C5502 DSP's highly integrated peripheral set includes: 32Kword DARAM and 16Kword ROM; 32bit external memory interface (EMIF); 16Kbyte of instruction cache; 16/8bit enhanced host port interface (HPI); six-channel direct memory access (DMA) supporting internal and external transfers; I2C interface to microcontrollers and codecs for inter-chip communication; and up to 76 general purpose I/O pins.

For the most cost-constrained applications, the C5501 DSP also delivers low power and high performance with reduced RAM and EMIF capability.

No other DSP on the market offers this level of performance with low power at these price points.

Customers currently using the C5000 platform devices can easily migrate to the C5501 and C5502 as both DSPs are pin-for-pin compatible, while maintaining TI's code compatibility commitment with 30 existing products in the platform.

The new devices are made possible by TI's advanced process technology and commitment to research and development.

TI has been at the forefront of process innovations such as 130nm copper interconnects and 300mm wafer production.

The move to 300mm wafers and a 130nm process provides up to 2.4 times more die per wafer than 200mm and can reduce production cost by up to a 60%.

These breakthroughs enable more chips to be manufactured at a lower cost with higher performance and lower power.

Designers can rapidly get to market with these new products by taking advantage of TI's comprehensive portfolio of development tools including more than 600 third-party algorithms and eXpressDSP reference frameworks, which allow developers to eliminate much of the initial low-level design decisions.

Each of the new devices is also supported by TI's Code Composer Studio v2 integrated development environment (IDE), the industry's most easy-to-use DSP IDE; the low-cost TMS320C5510 DSP starter kit; the C5502 evaluation module and an array of tools such as a datasheet/errata, application notes, workshops and online training.

Customers can register today for the C55x one-day workshops that will begin in the first quarter of 2003 at locations around the world.

• Texas Instruments (April 2001-March 2006): contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
•
• Electronicstalk Home Page

Search the Pro-Talk network of sites

Put your news on Electronicstalk  |   Advertise  |   Get the free Electronicstalk newsletter
Electronicstalk Home  |   About Electronicstalk  |   Copyright © 2000-2007 Pro-Talk Ltd, UK