Weight metrology aids thin-film research

A manual, benchtop nondestructive R and D metrology tool that offers atomic layer measurement accuracy to 7 angstroms of oxide has been launched by Metryx.

A manual, benchtop nondestructive R and D metrology tool that offers atomic layer measurement accuracy to 7 angstroms of oxide has been launched by Metryx.

The new, simple-to-use Metryx Monitor tool is ideal for both MEMS and semiconductor R and D applications where engineers want to measure material characterisation properties to atomic layer accuracies.

The Metryx Monitor is a manual bench-top version of the fully automatic Metryx Mentor system.

Based on the same novel measurement capability and innovative design, the Monitor brings atomic level weight measurement accuracy to the R and D environment and small scale production.

Innovative weight metrology technology used in the Monitor system enables noncontact thin film measurements to be realised, as well as wet and dry etch removal to be determined.

The weight metrology technique allows nondestructive atomic scale measurement accuracy on production, test or R and D wafers.

Small and compact enough to sit on top of a laboratory or clean room bench the Metryx Monitor is also able to be equipped with a custom made stand to become a free-standing piece of metrology equipment.

The system's software is both simple and versatile.

Advanced compensation algorithms, combined with unprecedented weighing accuracy, give the new benchtop metrology tool accuracy performance which is an order of magnitude better than compared with previous techniques.

The system allows the user to keep the last ten readings in the system's memory, which is also upgradable to interface with a PC for analytical purposes.

The LCD integrated to the front of the measurement chamber displays all the necessary readings and system status.

Operation is performed via a single twist-and-push knob positioned on the front of the chamber.

Measurements are conducted by manually loading the wafers into the weight measurement enclosure and the manual lid is closed.

After the lid is closed and thermal stabilisation occurs, the thermal plate lowers the wafer onto the load cell and the weight of the wafer is measured.

Accessories enable the user to connect the software to external computers and download manually measured data automatically, store and carry out basic calculations.

The Metryx Monitor range is designed to handle all wafer sizes up to 300mm.

The Monitor is also capable of measuring nonsilicon substrates and varying substrate shapes.

"Following on from the success of the Metryx Mentor system, the Metryx Monitor has been developed specifically for low volume R and D work in MEMS devices and semiconductors".

"Allowing substrates to be manually loaded, removes the sophistication of automatic loading, offering considerable cost reduction, while retaining the accuracy and measurement capability to atomic layer differentiation", explained Adrian Kiermasz, Vice President, Business Development of Metryx.

The Monitor metrology system is able to deal with many critical applications that other metrology systems cannot handle.

The benchtop tool is still sensitive enough to distinguish k variations from small changes in deposition parameters or moisture uptake.

In MEMS applications, release etch determination and silicon etch depth are two key applications being evaluated.

Dr Kiermasz also added: "The Metryx Monitor uses the same weight metrology breakthroughs employed in our fully automatic Metryx Mentor systems that have been purchased by some of the largest high volume production semiconductor manufacturers in the USA, Europe and Asia".

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