Product category: Electronics Manufacturing Machinery and Materials
News Release from: Kulicke and Soffa Industries | Subject: MaxSoft copper bonding wire
Edited by the Electronicstalk Editorial Team on 30 April 2007
Bonding wire for ICs
MaxSoft bonding wire has fine speed and cost-effectiveness ratings
Kulicke and Soffa Industries has brought out MaxSoft copper bonding wire engineered for a variety of discrete and IC applications. This new copper wire has novel physical properties that reduce IC bond pad sStress and significantly improve second bond strengths. With the new MaxSoft copper wire, customers now have a more reliable and cost-effective technology for fine wire used in copper-wire bonding of ICs.
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Applications using copper wire for bonding can prove challenging since copper inherently deforms less readily than gold wire, causing higher stress on the bond pad.
K and S laboratory results have shown that due to its lower wire hardness, MaxSoft reduces pad damage and provides stronger intermetallic connections, Klaus Dittmer, K and S Director of Product Marketing for Bonding Wires, states: 'In the past, copper wire bonding has had some real limitations with reliability and robustness in first and second-bond areas'.
'Our lab results show that the new MaxSoft copper wire increases overall bond strengths and reduces stress on the pads'.
Further reading
Boulanger takes charge of die bonder operations
Kulicke and Soffa Industries has appointed Richard Boulanger as General Manager of its die bonder operations located in Berg, Switzerland
Second-bond strength and consistency are more challenging attributes for copper wire compared to gold wire, particularly in fine-pitch applications.
This has created limitations to copper-wire bonding.
During K and S testing, MaxSoft obtained up to 35% higher second-bond pull responses compared with conventional copper wire, with increased bonding robustness.
'This new copper wire is yet another element of our total copper-wire bonding solution approach', explains Jack Belani, K and S Senior Vice President, Packaging Materials and Corporate Marketing'.
'Our customers now can have a comprehensive process solution with wire bonder copper kits, CuPRA plus capillaries combined with our copper wire product line'.
'Through MaxSoft, we are helping customers improve their copper wire bonding yields while providing new options for IDMs and subcontractors as they move from gold to copper'.
'The breakthrough with MaxSoft now enables our customers to remarkably improve both first and second bonds.' The new MaxSoft copper wire is available from 0.8 to 1.3 mil diameters and has a long shelf life of six months when stored in the recommended conditions inside the original packaging.
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