Product category: Electronics Manufacturing Machinery and Materials
News Release from: Kulicke and Soffa Industries | Subject: Cupraplus
Edited by the Electronicstalk Editorial Team on 14 December 2006
Capillary ensures greater
second bond quality
Kulicke and Soffa Industries has developed the Cupraplus that supports highly consistent and stable fine wire second bonds, while maintaining the quality of the overall wire bonding process
Expanding upon the capabilities of its highly successful copper capillary called Cupra, Kulicke and Soffa Industries has developed the Cupraplus that supports highly consistent and stable fine wire second bonds, while maintaining the quality of the overall wire bonding process. By ensuring both first and second bond quality during fine copper wire bonding, the Cupraplus Copper Capillary offers a more stable mass production process.
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'The formation of a fine wire second bond in fine copper wire bonding has been a constant obstacle, mainly due to frequent tail bond break failures, inconsistent second bond strength and an unstable bonding process window,' notes Jack Belani, Vice President, Marketing and Business Units at KandS, 'With its unique design and properties, KandS' Cupraplus Copper Capillary provides for increased second bond pull strength for a more stable and consistent quality bond throughout a process'.
Cupraplus Copper Capillary works together with KandS' iCu Copper wire and bonder kit to provide a complete solution for manufacturers looking to take advantage of the cost advantages offered by copper wire.
While KandS' original Cupra capillary offered superior bonding performance comparable to gold bonds on various pad materials, the Cupraplus takes fine copper wire bonding a step forward by ensuring both a quality first and second bond for superior process control and productivity.
Further reading
Boulanger takes charge of die bonder operations
Kulicke and Soffa Industries has appointed Richard Boulanger as General Manager of its die bonder operations located in Berg, Switzerland
'The Cupraplus addresses fine copper wire bonding process challenges by ensuring second bond quality and integrity along its lifetime,' notes Yair Alcobi, KandS Bonding Tools Director of Marketing.
'Easy to implement on any existing bonding platform, the Cupraplus has outperformed conventional capillary designs when tested on numerous applications - from fine pitch wire bonding to low pin count devices'.
Available in a range of wire diameters to address different wire bonding challenges, the Cupraplus can handle copper wire from 0.8 to 3.0mil thicknesses.
It is another example of the innovative and technologically advanced products that KandS is developing in support of customers with transition plans from Au to Cu.
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