Product category: Electronics Manufacturing Machinery and Materials
News Release from: Kulicke and Soffa Industries
Edited by the Electronicstalk Editorial Team on 20 November 2006
Boulanger takes charge
of die bonder operations
Kulicke and Soffa Industries has appointed Richard Boulanger as General Manager of its die bonder operations located in Berg, Switzerland
In this role, Boulanger will be responsible for overall manufacturing, R and D, product development and business operations for the facility, including the development of a next-generation die bonder platform and expansion into new markets throughout the world. 'With over 20 years of experience in the packaging assembly industry, Richard has the hands-on engineering, manufacturing and product development experience to really expand our die bonder market share and bring new technology to our customers', noted Christian Rheault, K and S equipment segment vice president.
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'Through our recent acquisition of Alphasem, we have established die bonder operations in Switzerland'.
'Richard will ensure a smooth transition among K and S, Alphasem employees and our worldwide customer base'.
Boulanger has extensive experience in semiconductor assembly.
Further reading
Capillary ensures greater second bond quality
Kulicke and Soffa Industries has developed the Cupraplus that supports highly consistent and stable fine wire second bonds, while maintaining the quality of the overall wire bonding process
Most recently, he served as Vice President of the Advanced Semiconductor Assembly Division of Universal Instruments Corporation, a business unit that provided full solutions for the precision placement of flip chips and bare die.
While at Universal, he helped develop a dominant worldwide market share of the flip chip on flexible circuit for the hard disk drive industry and the emerging package-on-package assembly.
He also led the team that won the 2006 Best Flip Chip machine from Advanced Packaging and the 2001 Best of Class VLSI Research Customer Satisfaction award.
Prior to joining Universal, Boulanger worked for IBM, primarily at their semiconductor assembly and test facility in Bromont, Quebec.
He holds an Industrial engineering degree from the Ecole Polytechnique of the University of Montreal and has published several papers on electronics packaging.
Boulanger will be based at K and S Switzerland facility.
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