Product category: Electronics Manufacturing Machinery and Materials
News Release from: Kulicke and Soffa Industries | Subject: EasylineE8202 and E8202P die bonders
Edited by the Electronicstalk Editorial Team on 25 April 2007
Die bonders improve productivity
KandS recently added the Alphasem family of dies bonders to its product portfolio through its recent acquisition of the company
Kulicke and Soffa Industries has released two new die bonders - the EasylineE8202 and E8202P - as the next generation of Alphasem die bonders. Engineered for greater productivity and performance, the Easyline E8202 offers greater speeds and throughput while the Easyline E8202P provides high precision +/-25um accuracy die bonding.
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KandS recently added the Alphasem family of dies bonders to its product portfolio through its recent acquisition of the company.
Based on Alphasem's highly successfully Easyline platform, both die bonders feature a high-speed air bearing pick and place system,a fully automatic wafer handling system and a closed-loop linear motor pick tool that ensures unparalleled bond line thickness control and a nonpiercing pick process.
Offering improved speed and throughput with accuracy of +/-38um, the Easyline E8202 Die Bonder is up to 30% faster than its predecessor - the E8032.
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Capable of +/-25um placement accuracy, the Easyline E8202P also provides greater precision with accuracy improved from +/-38um to +/-25um.
Both machines also incorporate maintenance-free air bearing technology for uptime higher than 97% in addition to top throughput per floor space with up to 11,500 cycles per hour.
They also offer simplified set-up with a graphical user interface in English and Chinese and fast product changeover, typically within five minutes.
Christian Rheault, KandS Vice President, Equipment Segment states, ' We've moved quickly with our Alphasem Engineering staff in bringing newer die attach technology to the marketplace'.
'The new Easyline E8202 and E8202P represent the first step in launching more accurate and faster die bonders'.
'Our customers can look forward to a totally new generation products to come from us over the next year'.
Both new die bonders will be available to the market in May 2007.
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