Electronics adhesives for high-value components

Intertronics has introduced the latest range of fast room-temperature-cure electronics adhesives from Dymax, which are particularly focused towards harsh-duty electronics applications.

The 9422-SC is a component ruggedising and staking material, engineered to hold critical components such as ball-grid arrays (BGA) and video graphics arrays (VGA) for secondary processes or for long-term reliability.

Dymax 9422-SC adhesive is engineered specifically for bonding of critical high-value electronic components, ensuring that they stay exactly in place on printed circuit boards throughout manufacture, assembly qualification and service/operation for the full product lifecycle.

Dymax 9422-C features a bead shape designed to wet both the board surface and the component edge without seeping into shadowed areas and is highly thixothropic for zero movement prior to cure, as well as being halogen and silicone free and RoHS compliant.

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