Laird releases rigid corner board-level shield

Laird Technologies, a supplier of customised performance-critical components for advanced electronics and wireless products, has released a rigid corner board-level shield (BLS).

The new shield incorporates a corner design that optimises component rigidity for increased part and printed circuit board (PCB) firmness.

As PCB designers are increasingly using thinner substrates, a rigid frame reinforces the assembly, thereby improving overall ruggedness and performance, according to the company.

The shield offers excellent solder joint reliability and resistance to solder joint fracture, especially in drop-testing performance with thin PCBs.

Several standard EMI-style parts, including single-piece, two-piece and multi-compartmental board-level shields, now use this new rigid corner design.

Laird claims that the new shield is stronger and more robust than traditional drawn shields, which results in a co-planarity improvement of the solder castellations.

The shield can tolerate more deflection, or handling, without plastic deformation.

The elimination of drawn flange reduces the space needed on the PCB for shielding trace width by potentially ~0.3mm, enabling the shield to be more closely placed on the PCB.

The elimination of draft allows for more under-shield space and improved component clearance.

The partially drawn corner is located near the top portion the shield, resulting in improved torsional rigidity with no drawn lip and no draft.

For parts higher than 2mm, the corner is drawn and formed with an interlocking multi-radius corner, which effectively shields electromagnetic interference (EMI).

The interlocking corner can be meshed and closed in during the forming and drawing process for the additional rigidity for parts taller than 2mm.

For parts smaller than 2mm, the entire corner is drawn without an interlocking corner.

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