Infineon teams up with Micron Technology

Infineon Technologies and Micron Technology have announced their collaboration for the development of high-density subscriber identity module (HD-SIM) cards reaching beyond 128MB of capacity.

HD-SIM cards combine high density with improved security functionality to enable operators to offer graphically-rich, value-added services such as mobile banking and contactless mobile ticketing.

Operators can securely update or delete applications through their wireless network while new applications, services and settings can be downloaded or pushed to the HD-SIM at any time.

This growth in functionality also means that storage solutions for the SIM need to keep evolving to take advantage of faster processing and communication speeds, ultimately delivering the higher memory capacity that these applications require.

To provide these needs, Infineon and Micron will develop their high-density products.

The companies will use their respective expertise to architect modular chip solutions that combine an Infineon security microcontroller with Micron's NAND flash memory with features designed specifically for HD-SIM applications.

Micron will manufacture the NAND on 50nm and 34nm process technology.

The joint solution is designed to be integrated into HD-SIM cards and will enable the cards to effectively reach beyond 128MB of capacity.

ECC (error correction codes) circuits are incorporated internally on the Micron NAND to relieve the data error correction burden from the HD-SIM microcontroller and streamline the overall security design.

The Infineon/Micron HD-SIM operates across the voltage range of 1.8V to 3.3V, complying with ETSI's recommendations for low-operating current.

The security microcontroller concept allows for migration between NOR- and NAND-based technologies as it features an aligned application protocol interface (API) and related software stack.

Operating system software developed for existing SIM cards can also be re-used.

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