Product category: Communications ICs (Wireless)
News Release from: Fujitsu Microelectronics Europe
Edited by the Electronicstalk Editorial Team on 9 September 2005
Hopling signs up for WiMAX SoC
Hopling Technologies has selected Fujitsu's MB87M3400 SoC as the standard silicon for its next generation HopMAX product portfolio
Hopling Technologies has selected Fujitsu's MB87M3400 SoC as the standard silicon for its next generation HopMAX product portfolio of basestation systems, micro basestations and high-end subscriber stations. Based on the ratified IEEE802.16-2004 specification, Hopling Technologies HopMAX product portfolio incorporates IP-rich systems functionality and the convergence of Hopling Technologies wireless mesh routing architecture enabling seamless metropolitan and event-based coverage, leveraging the advantages of WiMAX and Wi-Fi such as mobility, high throughput, low cost, and the ubiquitous of client devices, enabling a host of exciting new applications and business models.
This article was originally published on Electronicstalk on 9 September 2005 at 8.00am (UK)
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'Our partnership with Fujitsu Microelectronics Europe gives Hopling Technologies access to state-of-the-art chip technology', said Ivo van Ling, Chief Technology Officer.
'As we expand our product portfolio, we feel secure that Fujitsu's innovative system-on-chip technology allows us to meet the rapidly changing business needs of our customers'.
'This collaboration also provides assurance to Hopling Technologies' customers that the broadband technology products they buy today offers future-grade functionality'.
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Manfred Mettendorff, Senior Marketing Manager at Fujitsu Microelectronics Europe added: 'In Europe in particular, we are experiencing a rapid implementation of WiMAX'.
'Fujitsu's cost efficient solution enables Hopling Technologies to offer competitive business models with fast return on investment'.
'Today's announcement marks an important step towards accelerating the delivery of ubiquitous broadband wireless computing and connectivity to more people than ever before', said Frank Koopman, Chief Executive Officer of Hopling Technologies.
'By launching the next generation HopMAX products, Hopling Technologies brings its meshed network expertise to the delivery and integration of converged WiMAX based solutions'.
The WiMAX and mesh hybrid Xnet Mark-III node and the next generation HopMAX products will become commercially available later in the year.
Hopling Technologies and Fujitsu plan ongoing, comprehensive support for the current and future WiMAX standards, as the WiMAX Forum and its member companies work to deliver IEEE802.16e to serve mobile wireless broadband applications.
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