Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: ProFlow DirEKt
Edited by the Electronicstalk Editorial Team on 09 October 2001
Enclosed head printing gains support
worldwide
Enclosed-head screen printing was introduced to the electronics assembly industry in 1997, and aimed to reduce materials wastage, minimise operator intervention and tighten process control.
Enclosed-head screen printing was introduced to the electronics assembly industry in 1997, and aimed to reduce materials wastage, minimise operator intervention and tighten process control Four years on, DEK's ProFlow DirEKt Imaging technology has been licensed by the majority of screen printing equipment manufacturers and is supported by solder paste producers worldwide
This article was originally published on Electronicstalk on 4 Oct 2001 at 8.00am (UK)
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Printers improve their image
DEK has upgraded its ProFlow DirEKt imaging system to enhance its effectiveness and applications.
Manual helps get the most out of imaging kit
DEK has published a free 'best working practices' manual to help users to maximise the effectiveness and efficiency of their ProFlow DirEKt imaging equipment.
Among the user community, early uncertainties surrounding paste compatibility and the practical extent of materials savings slowed adoption in the marketplace, but over 1000 ProFlow units are now in action around the world.
Now, further additions to the ProFlow product range are also enabling screen printing to perform a wider range of electronic manufacturing processes.
Technical analysis after the launch of ProFlow DirEKt Imaging confirmed a definite superiority over squeegee based printing in most surface mount applications.
Further reading
Guide justifies ProFlow process
Continuing DEK's commitment to helping customer's maximise the effectiveness and efficiency of ProFlow Direkt Imaging, DEK has published a free implementation guide.
Mass imaging improves IC thermal performance
DEK has successfully applied mass imaging techniques to improve the uniformity of thermal interface material deposited between a silicon die and its package lid during semiconductor packaging.
Foils developed for large frameless stencils
DEK has extended its VectorGuard to 29" by 29" - a convenient new frameless foil system that is said to be set to revolutionize large format applications.
Compared to the new technology the traditional squeegee was slow, relatively inconsistent and, importantly, meant large quantities of solder paste frequently dried on the stencil surface and had to be discarded.
Enclosed head printing aimed to make preplacement less messy by enclosing solder paste within a quick-change cassette.
This not only isolated the paste from ambient conditions but also made stencil cleaning easier and less frequent, and claimed to create a better gasket seal between the stencil and the board by decoupling contact pressure from the paste transfer force.
This would lead to improved paste volume consistency and reduced smearing.
Furthermore, the improved material control offered by the cassette and enclosed head highlighted ProFlow's potential to introduce screen printing in a wider variety