Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: ProFlow DirEKt
Edited by the Electronicstalk Editorial Team on 15 October 2003
Mass imaging improves
IC thermal performance
DEK has successfully applied mass imaging techniques to improve the uniformity of thermal interface material deposited between a silicon die and its package lid during semiconductor packaging
DEK has successfully applied mass imaging techniques to improve the uniformity of thermal interface material (TIM) deposited between a silicon die and its package lid during semiconductor packaging processes. By mass imaging the TIM using ProFlow DirEKt imaging, semiconductor manufacturers can now be sure that the die surface is covered by a uniform thickness of TIM.
This article was originally published on Electronicstalk on 15 October 2003 at 8.00am (UK)
Related stories
Enclosed head printing gains support worldwide
Enclosed-head screen printing was introduced to the electronics assembly industry in 1997, and aimed to reduce materials wastage, minimise operator intervention and tighten process control
Printers improve their image
DEK has upgraded its ProFlow DirEKt imaging system to enhance its effectiveness and applications
Advantages include better thermal connectivity between the die and the lid, which improves reliability, as well as greater coplanarity of the lid.
DEK will also soon conclude development of a lid sealing process that will complement its TIM deposit process to create a complete mass imaging solution for lid attachment.
Overseeing the project, DEK's David Foggie said: 'The results from our first customer trials have shown that mass imaging is significantly more controllable and repeatable than traditional dispensing when depositing TIM.
Moreover, our new process makes it easier to verify uniform spreading and absence of voids before the package lid is assembled.
This process adds a further semiconductor packaging process to those we have successfully enhanced using our ProFlow DirEKt imaging technology and underlines the versatility and value of mass imaging to the packaging industry'.
Further reading
Platform streamlines screen printing
The Horizon 03i comes equipped with DEK's Instictiv user interface and the ISCAN control network, which supports a faster, lighter and more reliable bus system
System doubles printing output
DEK's new solution delivers full in-line production at high speed, while occupying a significantly reduced line footprint
Printer handles tough substrates
Reel-to-Reel printing delivers an accurate, cost-effective and versatile process solution to optimise complex and continuous assembly
Die that have been assembled onto substrates enter a flexible printing platform that combines three processes, passive attach, TIM and lid sealing, into a single platform, giving the customer the flexibility to redeploy equipment between processes to meet changing market demand and to respond to future.
In addition, operators only need to be trained on one platform, and spares inventory is also streamlined.
Compared with traditional dispensing processes, mass imaging increases true throughput and delivers greater control over the volume of material deposited.
Mass imaging also allows the shape of the TIM deposit to be more accurately controlled, and more repeatable.
The thickness of the initial deposit is also more uniform across the surface of the die.
Because the process does not rely on placing the lid to spread the TIM, flaws such as voids in the material or incomplete spreading are eliminated.
This is very important to semiconductor manufacturers and packaging specialists, since these flaws are very difficult to inspect after the lid has been placed.
TIM is frequently used when packaging semiconductor components that must dissipate substantial amounts of heat.
The material has a high coefficient of thermal conductivity, and fills the void between the upper surface of the silicon die and the package lid.
The package lid is subsequently bonded to the device's substrate.
During operation of the device, the TIM will conduct heat away from the die to the package surface, from where it can be dissipated efficiently by convection from the surface of the lid, by an external heatsink, or by forced air cooling using a fan.
• DEK: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
