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Product category: Design and Development Software
News Release from: Cadence Design Systems | Subject: Allegro PCB SI 630
Edited by the Electronicstalk Editorial Team on 25 June 2004

Simulator tackles multigigahertz design

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Allegro PCB SI 630 is billed as the PCB industry's most advanced solution for multigigahertz (MGH) design

This industry-first solution is optimised for scattering parameter (S-parameter)-based interconnect characterisation and offers revolutionary technology for high-capacity simulation of serial links, such as those found in PCI Express, XAUI, Serial ATA II, Infiniband and other interface standards that operate at or above 2.5Gbit/s.

The newest addition to the Cadence Allegro system interconnect design platform, Allegro PCB SI 630 delivers an integrated design and analysis environment for designing complex digital PCB systems with MGH signals.

As data transfer rates increase, effects of discontinuities in the signal path can linger for many transfers and must be studied in detail to ensure timing and voltage margins are met.

The Allegro PCB SI 630 solution enables detailed analysis of millions of data transfers on the board, across multiple boards, and across silicon-package-boards with unprecedented performance.

It is the first commercially available product on the market with high-capacity simulation (channel analysis) technology that can simulate 10,000 bits in seconds.

"We are working closely with Cadence to define and develop solutions that will allow customers to perform modelling of their high speed serdes based designs", said Richard Busch, Director of the ASIC Business Unit, IBM Systems and Technology Group.

"Until now, this type of simulation has been virtually impossible as serdes vendors were required to develop proprietary, customised tools".

"This new multigigahertz signal design technology is a great step towards a common signal integrity analysis tool for system designers, IC vendors, and the industry at large".

A comprehensive design and analysis suite created for the SI engineer, Allegro PCB SI 630 is the only solution on the market with completely integrated S-parameter support and high-capacity simulation, shortening design cycle time for designs with MGH signals.

This new solution also allows users to explore and resolve electrical performance-related issues in every stage of the design cycle and helps ensure that timing and voltage margins are met for MGH signals in a virtual prototyping environment.

The need to conduct multiple qualifications in the lab is greatly reduced through advanced simulation techniques, allowing engineers to avoid one or more PCB prototype iterations.

"As data rates, carrier frequencies and specification complexities increase, so does the designer's need to utilise a broader range of fast and accurate design tools".

"No tool today, other than the Allegro PCB SI 630 solution, allows simulation of 10,000 bits for MGH signals in seconds", said Charlie Giorgetti, Corporate Vice President and General Manager of the Silicon-Package-Board Business Unit at Cadence.

"The newest addition to our Allegro PCB SI series will enable our customers to validate their MGH signals before a physical prototype is created, resulting in improved design cycle time and faster time to market".

"Designing a complete, reliable high-speed system requires attention to issues at the chip, package and board levels", said Kevin M Roselle, Chief Technology Officer, Bayside Design.

"This is especially true in today's systems with deep submicron silicon which characteristically have very low voltages, high power and MGH I/O signalling speeds".

"Allegro PCB SI 630 allows users to do iterative loss-budget tradeoffs in an integrated PCB design environment very quickly, shortening design cycle time while improving a products' performance through optimised MGH interconnect".

Cadence Allegro PCB SI 630 is available now.

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