Product category: Communications ICs (Wireless)
News Release from: Bops | Subject: Wireless LAN SoC in a Box
Edited by the Electronicstalk Editorial Team on 23 May 2001
SoC handles multistandard wireless networking
Bops has announced its second SoC in a Box with its multistandard wireless LAN solution
Bops wireless LAN SoC in a Box is a licensable system-on-chip (SoC) solution designed to drastically reduce time-to-market and technical risk for wireless vendors and chip companies. It was developed in conjunction with partners Tality Corp, HelloSoft, Fraunhofer Institute for Integrated Circuits, Applied Electronics and is supported by Taiwan semiconductor manufacturing Company (TSMC).
This article was originally published on Electronicstalk on 23 May 2001 at 8.00am (UK)
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"The various 802.11 standards are still in flux.
We have the ideal solution for situations such as week before last when the FCC opened new options for the 2.4GHz band", said Mark Bowles, president and COO, Bops, "The beauty of Bops architecture is that it is inherently scalable and reusable - and therefore flexible enough to adapt to whatever the standards ultimately look like".
"With this SoC in a Box, we offer wireless equipment vendors and chip companies the ability to rapidly introduce new wireless products - dynamically programmable and low power - for any or all standards", said Bowles.
"Additionally, as a thread c-processor to ARM, MIPS and other hosts, Bops allows customers to leverage existing software infrastructure already ported to their choice of host CPU".
Bops Wireless LAN SOC in a Box is a prepackaged application solution that includes complete sample hardware and software design along with implementation services for IEEE 802.11b, 802.11g, 802.11a, and ETSI BRAN HiperLAN/2 wireless applications.
Further reading
Two new VPs at Bops
Programmable DSP core producer Bops has named Steven E Schulz as vice president, corporate marketing, and Ivan Greenberg, vice president, platform marketing, effective immediately
Angelic C compiler beats DSP benchmarks
EEMBC Certification Laboratories (ECL), the independent benchmarking certification service and embedded product testing organisation, has tested and certified Bops' new Halo C compiler
Low-power DSP cores deliver 100MIPS/mW
Bops has released a range of low-power-consumption DSP cores designed to extend battery life without giving up the high performance required by the next-generation of mobile devices
Also, the solution fully supports other applications using orthogonal frequency division multiplexing (OFDM), in both unlicensed and licensed radio frequency bands, ie IEEE 802.16 standards.
The SoC design is offered by Bops in collaboration with Tality Corp, which provides hardware, system, and radio front-end design services; HelloSoft, which provides software services; and Fraunhofer Institute, which provides IP and design services.
Customer-specific implementations of the SoC design - including system design, peripheral design and SOC implementation services - are available through Tality, Fraunhofer IIS-A, Bops and their respective partners.
Including fully configurable MAC and PHY, the Wireless LAN SoC in a Box delivers the only complete and programmable solution for new software-defined wireless LAN integrated products.
The foundation of the Wireless LAN SoC in a Box is the Bops WirelessRay DSP core that meets the high-performance and low-power needs for wireless access points, client adapters, and other network-enabled mobile devices.
Bops WirelessRay core delivers 802.11b/g/a physical layer processing at less than 70mW.
A hard macro of WirelessRay will be available in TSMC's 0.13-micron process in Q301.
Bops WirelessRay soft core is available now.
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