Week 20 October - 26 October 2002
Showing 1 - 10 of 107 articles
Small form factor for pluggable transceivers
Agilent Technologies has developed a new series of small form factor pluggable (SFP) fibre-optic transceivers for Sonet/SDH networks.
News from Agilent Technologies, 25 October 2002
Test sockets come with load boards
Aries Electronics has formed a mutual distributor relationship with Altanova to provide a more complete semiconductor test solution.
News from Aries Electronics, 25 October 2002
Microsoft award for Arcom
Microsoft Corp has chosen Arcom to receive a Windows Embedded Partner of the Year Award in the category of Independent Hardware Vendor.
News from Arcom, 25 October 2002
Pan-European network supports PSU design
Artesyn Technologies has established a new pan-European network of technical sales representatives.
News from Artesyn Technologies, 25 October 2002
Bluetooth chip powers Murata Blue Module
User Application Article
Murata has unveiled an extremely small Bluetooth module incorporating the Cambridge Silicon Radio BlueCore2 chip.
News from Cambridge Silicon Radio, 25 October 2002
Phase-control thyristors run to higher voltages
Dynex Semiconductor has six new high-power phase-control thyristors with repetitive voltage ratings at 125C from 1800 to 6500V aimed at high-voltage power supplies and power conversion.
News from Dynex Semiconductor, 25 October 2002
Platform boasts five-nines availability
The EndurX C21K system is based on the open-standards High Availability Architecture from Force Computers for an Ultra Availability solution of "zero-downtime" services.
News from Force Computers, 25 October 2002
Diode array protects two USB ports at once
The ProTek Devices USB208 is a USB protection device in a miniature surface-mount package.
News from Hunter Electronic Components, 25 October 2002
Free software aids test system intgration
LabTracer is a free Windows application that allows simultaneous use of up to four Keithley SourceMeter instruments.
News from Keithley Instruments, 25 October 2002
Further information availableI/O scheme makes the most of 90nm ASIC wire bonds
Pad on I/O is an industry first for copper/low-K processes in wire bond packaging.
News from LSI Logic Europe, 25 October 2002
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Featured articles
- Teseq releases PMM 9010/30P EMI receiver/analyser
Teseq is offering a digital EMI receiver/analyser with optimum measurement parameters for EMC labs that do not require full CISPR compliance for radiated emissions measurements. - Schroff Card-Lok can be compressed from both ends
The Series 236 Card-Lok from Schroff incorporates a dual-thread design that allows the device to be compressed from both ends by turning a single screw.
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