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Product category: IC and Hybrid Processing Equipment
News Release from: Kulicke and Soffa Industries
Edited by the Electronicstalk Editorial Team on 15 July 2003
National signs up for wire bonders
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National Semiconductor has signed a volume purchase agreement (VPA) for the purchase of Maxum wire bonders.
National Semiconductor has signed a volume purchase agreement (VPA) for the purchase of Maxum wire bonders The agreement defines an agreed price for the wire bonders which will be delivered to National's facilities in Singapore and Malaysia