Editor's note: Readers of the free Electronicstalk weekly email newsletter will have read this news the week it was announced. Click here to request to be added to the circulation.
Good news for laser diode packaging comes from Production Equipment Sales (PESL) in the shape of the Diemat range of glass preforms for use in hermetically sealing glass to metal.
Specifically, small diameter glass tube feed-throughs may be sealed by a small donut shaped glass preform to a Kovar package at temperatures as low as 320C.
The preform replaces solder at a fraction of the cost by simplifying the manufacturing process.
In addition is eliminated along with the plating requirements, voiding, stress concentrations, flux residue cleaning, or non oxidizing atmospheres associated with solder.
Designated DM2700PF, these clean sealing preforms can be processed in a matter of seconds without residue and are available with hole sizes as small as 0.010in.
The Diemat process features a preformed glass collet which fits over the optic fibre.
The preform (with fibre) is then induction heated in a metal head, (generally to just over 350C) this flows the collet into the header while maintaining central alignment of the fibre and provides a hermetic glass to metal seal in the laser package.
This process replaces solder and associated need for fibre metalisation, it is fatigue and corrosion resistant without creepage.
The no-flux process takes less than 10s, has high adhesion and proven reliability associated with low thermal stresses.
Preforms are available in a variety of sizes ranging from 0.010in inner diameter doughnuts to large forms up to 1in or larger in various shapes.
 

• See contact details for Production Equipment Sales and other news
• Email this news to a colleague