Product family covers densities from 16 to 512Mbit and supports both -40 to +85C (A1 grade) and industry leading -40 to +105C (A2 grade) temperature ranges.

News from Integrated Silicon Solution, Nov 6, 2007

FRAM device speeds into powertrain systems

Automotive-temperature FRAM is a direct hardware replacement for equivalent EEPROMs, yet far superior because of its fast writes, virtually unlimited endurance and low operating currents.

News from Ramtron International, Nov 1, 2007

FRAM provides speed and reliability

Fimicro's SBC and smart I/O boards incorporate four 4Mbit parallel FRAM devices, forming a nonvolatile memory array of 2Mbyte from which the system can boot directly.

News from Ramtron International, Oct 18, 2007

nvSRAM offers short access times

Cypress's S8 0.13um SONOS (silicon oxide nitride oxide silicon) embedded nonvolatile memory technology enables greater densities and improved access times and performance.

News from Cypress Semiconductor, Oct 16, 2007

Dynamic RAM claims industry speed record

The latest addition to the XDR DRAM family provides an industry-leading data transfer rate of 9.6Gbyte/s with a single device.

News from Rambus, Oct 8, 2007

Ferroelectric RAM runs up to 2Mbit density

High density FRAM device targets SRAM-based industrial control, metering, medical, automotive, military, gaming and computing applications.

News from Ramtron International, Oct 5, 2007

Small-format SD cards boost storage to 4Gbyte

MicroSDHC cards are perfect to meet the rising communication and multimedia demands of mobile phones and digital devices.

News from Kingston Technology, Oct 1, 2007

Third-generation modules save embedded space

Memory modules are designed for space constrained next-generation AdvancedTCA, AdvancedMC, MicroTCA, PicoTCA, PC104, SBB canisters and PICMG SBCs.

News from Virtium Technology, Sep 26, 2007

EEPROM devices handle 125C temperatures

The 25XX512 and 25XX1024 are the industry's only 512Kbit and 1Mbit SPI serial EEPROMs specified to operate up to 125C.

News from Microchip Technology, Sep 24, 2007

Serial EEPROMs come in low-profile 8-pin packages

The novel XDFN package is ideal for height-constrained comms applications such as headsets, wireless LAN adapters and Bluetooth modules.

News from Atmel Corporation, Sep 21, 2007

Flash facility begins producing 300mm wafers

The SP1 wafer manufacturing site is the first factory constructed by Spansion since becoming an independent company.

News from Spansion, Sep 20, 2007

State saver avoids data loss

The FM111x operates like a conventional logic building block, but stores and retains the logic state in the absence of power.

News from Ramtron International, Sep 11, 2007

Wafer fab is ready for Flash expansion

Latest 300mm wafer fabrication facility is expected to start mass production in December 2007 and reach a production capacity of 80,000 wafers a month in the second half of 2008.

News from Toshiba Electronics Europe, Sep 10, 2007

SHDC card runs up to 32Gbyte

New cards meet the Class 4 specification in the SD speed class, ensuring they deliver the high level performance and functionality.

News from Toshiba Electronics Europe, Sep 7, 2007

FRAM device handles automotive temperatures

The FM25640-GA 5V, 64Kbit FRAM is now Grade 1 AEC-Q100 specified, making it suitable for automotive applications under the hood.

News from Ramtron International, Sep 4, 2007

Serial Flash runs faster

32Mbit serial Flash device with dual I/O guarantees high-speed performance in digital flat panel and set-top-box applications.

News from STMicroelectronics, Aug 30, 2007

Flash drives enhance PC performance

Memory devices enable users to boost system responsiveness of PCs running Vista by using USB memory as external memory.

News from Toshiba Electronics Europe, Aug 15, 2007

Asynchronous SRAMs support legacy systems

In addition to 1.8, 2.5 and 3.3V SRAMs, Integrated Silicon Solution now has a wide variety of 5V SRAMs from 256Kbit to 4Mbit.

News from Integrated Silicon Solution, Aug 14, 2007

CompactFlash cards lead for speed

PQI's 300x CF cards provide up to 45Mbyte/s reads and 34Mbyte/s writes - well above rapid continuous photo shoot requirements.

News from PQI Europe, Aug 13, 2007

Serial Flash boasts fastest interface

Quad-SPI architecture allows for greater than six times the performance of the current generation of serial Flash memories and offers a true code-execution alternative to parallel-NOR Flash.

News from Winbond Electronics Corp America, Aug 8, 2007

NOR Flash is ready for Chinese handset designs

Prequalification of Flash memory will enable manufacturers to get cost-effective, high-performance phones to market faster in China and other high-growth regions.

News from Spansion, Aug 7, 2007

Ferroelectric RAM remembers in-car entertainment

Daesung-Eltec of Korea has used FRAM in the design of its new digital signal processing based car audio platform.

News from Ramtron International, Aug 2, 2007

Controllers take charge of solid-state storage

NAND controllers allow system manufacturers to optimise NAND costs, availability and performance requirements in the face of fast-changing NAND technologies.

News from Silicon Storage Technology, Jul 31, 2007

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Memory devices and modules

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Memory devices and modules:

Memory devices are used to store information in a system. There are many types of memory but these can be generically classified into either volatile or non-volatile devices.

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